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Patent Searching and Data


Title:
AUTOMATIC POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/198313
Kind Code:
A1
Abstract:
Provided is an automatic polishing system such that a polishing controller (6) controls a polishing robot (2) and a polishing tool (4) so that the polishing tool (4) performs polishing operation on a surface A to be polished, wherein a color intensity measuring device N (3, 7, 9) for measuring the intensity of a specific color on the surface A to be polished is provided, and the polishing controller (6) controls the polishing robot (2) and the polishing tool (4) on the basis of the intensity of the specific color measured by the color intensity measuring device N so that the amount of the polishing work of the polishing tool (4) on the surface A to be polished is adjusted according to the intensity of the specific color.

Inventors:
SHIWA HIDEO (JP)
NAKAYAMA GENJI (JP)
HIGASHI YOSHIO (JP)
Application Number:
PCT/JP2019/003800
Publication Date:
October 17, 2019
Filing Date:
February 04, 2019
Export Citation:
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Assignee:
TAIKISHA KK (JP)
International Classes:
B24B27/00; B24B49/12; G01B11/24; G01N21/84
Domestic Patent References:
WO1997017173A11997-05-15
Foreign References:
JPH05138531A1993-06-01
JP2003338493A2003-11-28
JP2008091951A2008-04-17
JP2015139836A2015-08-03
JP2002283099A2002-10-02
JP2007021634A2007-02-01
JPH0592345A1993-04-16
JP2016155202A2016-09-01
JP2015016540A2015-01-29
JP2004009259A2004-01-15
JP2019005825A2019-01-17
JP2017121582A2017-07-13
Other References:
See also references of EP 3593944A4
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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