Title:
AUTOMATIC VACUUM RESIN MOLDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/1987/001328
Kind Code:
A1
Abstract:
A resin molding apparatus for obtaining a specimen of a resin product by using a simply-made mold under vacuum and a method of preventing bubbles from being mixed in a mixing agent. This automatic vacuum resine molding apparatus is constructed as follows. Tanks (11, 13) for holding separately a main agent (10), which consists of a synthetic resin liquid, and a hardening agent (12) are provided in a sealed container (4), which has a vacuum pump (1), and which can be opened and closed. The outlets of the tanks (11, 13) are joined to pipes (18, 19) which are provided with electromagnetic valves (16, 17), respectively, with the lower ends of these pipes (18, 19) positioned in an agitation means (20). A mold unit (27) having therein a product mold (30) is set below the agitation means (20). The molding apparatus thus constructed is automatically controlled.
Inventors:
SHIMIZU KATSUAKI (JP)
Application Number:
PCT/JP1985/000485
Publication Date:
March 12, 1987
Filing Date:
September 02, 1985
Export Citation:
Assignee:
SANAI CO LTD (JP)
International Classes:
B01F7/00; B01F13/06; B29C39/24; B29C39/42; B29C33/36; (IPC1-7): B29C39/02; B29C39/22; B29C39/26; B29C39/42; B29B7/42
Foreign References:
| JPS5024345B2 | 1975-08-14 | |||
| JPS5643648B2 | 1981-10-14 | |||
| JPS5124665A | 1976-02-28 | |||
| JPS49110750A | 1974-10-22 | |||
| JPS4017981Y1 |
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