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Patent Searching and Data


Title:
AUTOMOBILE BUMPER
Document Type and Number:
WIPO Patent Application WO/2015/080037
Kind Code:
A1
Abstract:
An automobile bumper is configured in such a manner that: a frame (36) having relatively high strength and a frame (37) having relatively low strength are arranged side by side on the inside and outside in the vehicle width direction; a fiber-reinforced resin bumper beam extension (12) is affixed to the front ends of both the frame having relatively high strength and the frame having relatively low strength; and a fiber-reinforced resin bumper beam (11) is affixed to the front end of the bumper beam extension (12). The bumper beam extension is provided with an imaginary rectangular cross-section section (40) located on lines extended from the frame having relatively high strength and a rectangular cross-section. The imaginary rectangular cross-section section is provided with: two each of first and second ridge lines (c1, c2) located on lines extended from the four ridge lines (a1, a2) of the frame having relatively high strength; and two, third ridge lines (c3) located on lines extended from two ridge lines (b) of the frame having relatively low strength, the two ridge lines (b) being located on the inside in the vehicle width direction. This configuration prevents the fiber-reinforced resin bumper beam extension from tilting outward in the vehicle width direction due to a collision load and increases an energy absorption effect.

Inventors:
YASUHARA SHIGETO (JP)
KASHIWAGI MASAKAZU (JP)
MAESAKO YUSUKE (JP)
YABU TOMOYA (JP)
ARAKI JUNICHIRO (JP)
Application Number:
PCT/JP2014/080874
Publication Date:
June 04, 2015
Filing Date:
November 21, 2014
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B60R19/04; B60R19/24; B60R19/34
Domestic Patent References:
WO2013094515A12013-06-27
WO2014106924A12014-07-10
Foreign References:
JP2010125884A2010-06-10
JP2013052856A2013-03-21
JP2008221987A2008-09-25
JPH0292756A1990-04-03
JP2008100558A2008-05-01
Attorney, Agent or Firm:
OCHIAI Takeshi et al. (JP)
Ochiai 健 (JP)
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