Title:
BACK CHANNEL-ETCHED OXIDE SEMICONDUCTOR TFT SUBSTRATE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/080254
Kind Code:
A1
Abstract:
A back channel-etched oxide semiconductor thin film transistor (TFT) substrate and a preparation method therefor. The preparation method for a back channel-etched oxide semiconductor TFT substrate comprises: configuring an active layer (40) as a dual layer structure, preparing a first oxide semiconductor layer (401) that is located at a lower layer according to normal deposition processing parameters, resulting in a normal density, and preparing a second oxide semiconductor layer (402) that is located at an upper layer by means of changing the deposition processing parameters, resulting in a higher density; the first oxide semiconductor layer (401) has a lower density and has a higher transfer rate, while the second oxide semiconductor layer (402) has a higher density, a lower number of thin film defects and stronger etching resistance, which may reduce the damage to a channel region (41) of the active layer (40) during the etching of a drain (51) and a source (52), while saving the photomask of an etching barrier layer, preparation costs being low.
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Inventors:
YU MINGJUE (CN)
HSU YUANJUN (CN)
ZHOU XINGYU (CN)
HSU YUANJUN (CN)
ZHOU XINGYU (CN)
Application Number:
PCT/CN2017/113547
Publication Date:
May 02, 2019
Filing Date:
November 29, 2017
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L27/12; H01L27/32; H01L51/56
Foreign References:
CN104022044A | 2014-09-03 | |||
CN106057679A | 2016-10-26 | |||
CN103000628A | 2013-03-27 | |||
CN105304650A | 2016-02-03 | |||
US20140070210A1 | 2014-03-13 |
Attorney, Agent or Firm:
COMIPS INTELLECTUAL PROPERTY OFFICE (CN)
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