Title:
BACKFILL STRUCTURE AND BACKFILL METHOD
Document Type and Number:
WIPO Patent Application WO/2011/036991
Kind Code:
A1
Abstract:
Disclosed is a backfill structure that is suitable for comparatively small-scale land improvement, and wherein problems such as a retaining wall being unstable after construction do not occur. The backfill structure for building an underground structure is characterized by comprising a plurality of wall surface panels (1) disposed vertically in front of natural ground, linking members (2) that penetrate through-holes provided to the wall surface panels to bind the wall surface panels, a mesh sheet (3) fastened by the other ends of the linking members (2), and a backfill soil body that is piled on the mesh sheet (3) and that buries and immobilizes the mesh sheet (3); and by the space between the wall surface panels (1), the back side of the wall surface panels, and the natural ground being filled by the backfill soil body.
Inventors:
KAMATA Yoshio (4-25 Hamamatsu-cho 2-chome, Minato-k, Tokyo 13, 〒1050013, JP)
Application Number:
JP2010/065014
Publication Date:
March 31, 2011
Filing Date:
September 02, 2010
Export Citation:
Assignee:
NIHON KANKYO SEIZOU KABUSHIKI KAISHA (4-25, Hamamatsu-cho 2-chome Minato-k, Tokyo 13, 〒1050013, JP)
日本環境製造株式会社 (〒13 東京都港区浜松町２丁目４番２５号 Tokyo, 〒1050013, JP)
日本環境製造株式会社 (〒13 東京都港区浜松町２丁目４番２５号 Tokyo, 〒1050013, JP)
International Classes:
E02D17/18
Attorney, Agent or Firm:
TACHIBANA Tetsuo (3F. YKB Ensign Building, 28-4 Yotsuya 4-chome, Shinjuku-k, Tokyo 04, 〒1600004, JP)
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