Title:
BACKING PAD FOR WORKPIECE CARRIER
Document Type and Number:
WIPO Patent Application WO1999048645
Kind Code:
A8
Abstract:
A carrier (100) for semiconductor wafers (106) to be polished comprises a backing pad (110) vulcanized to a pressure plate (108). The backing pad (110) is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad (110) and pressure plate (108). The backing pad (110), adhesive film and pressure plate (108) together comprise a nearly ideally elastic assembly. The exposed face of the backing pad (110) is profiled to a desired profile without effecting crumbling of the rubber material.
Inventors:
FRUITMAN CLINTON O (US)
CROSBY THOMAS K (US)
SCHLEUTER JAMES (US)
CROSBY THOMAS K (US)
SCHLEUTER JAMES (US)
Application Number:
PCT/US1999/005898
Publication Date:
February 15, 2001
Filing Date:
March 18, 1999
Export Citation:
Assignee:
SPEEDFAM IPEC CORP (US)
FRUITMAN CLINTON O (US)
CROSBY THOMAS K (US)
SCHLEUTER JAMES (US)
FRUITMAN CLINTON O (US)
CROSBY THOMAS K (US)
SCHLEUTER JAMES (US)
International Classes:
B24B41/06; B24D18/00; (IPC1-7): B24B37/04
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