Title:
BACKSIDE ILLUMINATION IMAGE SENSOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/142573
Kind Code:
A1
Abstract:
Provided in the present application are a backside illumination image sensor, a manufacturing method therefor and an electronic device, which relate to the field of sensors. By means of arranging a metal layer on a detection surface, the backside illumination image sensor enables the intermediate energy level caused by interface defects to be far away from the Fermi level, thereby reducing the dark current of a sensor, and enhancing the anti-radiation performance. The backside illumination image sensor comprises a substrate, and a metal wiring layer, a semiconductor layer and a metal layer which are sequentially arranged on the substrate. A pixel array is distributed in the semiconductor layer, and the surface, away from the substrate, of the semiconductor layer is a detection surface for the pixel array. The metal layer is arranged on the detection surface, and the work function of a metal material used by the metal layer is greater than that of a semiconductor material in the semiconductor layer.
Inventors:
HUANG LIUBING (CN)
LI LINGFEI (CN)
WU YING (CN)
XU JEFFREY JUNHAO (CN)
LI LINGFEI (CN)
WU YING (CN)
XU JEFFREY JUNHAO (CN)
Application Number:
PCT/CN2022/128944
Publication Date:
August 03, 2023
Filing Date:
November 01, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L27/146
Foreign References:
| CN104377214A | 2015-02-25 | |||
| CN104137263A | 2014-11-05 | |||
| CN104377215A | 2015-02-25 | |||
| CN108702471A | 2018-10-23 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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