BAFFLE DEVICE FOR HOT-DIP PLATING PROCESS

WIPO Patent Application WO/2024/075896

A1

The present invention relates to a baffle device for a hot-dip plating process. The baffle device comprises a baffle plate and a support for supporting the baffle plate from above. The support includes an upper support provided with a first insertion groove, a second insertion groove, and a first fixing member. Also, the support further includes a lower support provided with a first roller, a second roller, and a second fixing member. In order to couple the upper support and the lower support, the first roller and the second roller are inserted into the first insertion groove and the second insertion groove. When the first roller and the second roller are inserted into the first insertion groove and the second insertion groove, the first fixing member and the second fixing member come into close contact with each other and suppress the movement of the lower support relative to the upper support.

HEO KI BOK (KR)
KIM YOUN JA (KR)
HEO SUNG (KR)
JOO DEOK BONG (KR)
JEONG SEUNG KIL (KR)

PCT/KR2022/019759

April 11, 2024

December 07, 2022

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SAMWOOECO CO LTD (KR)

C23C2/20; C23C2/00; C23C2/06; C23C2/28

KR20060003447A	2006-01-11
KR101008184B1	2011-01-14
JP2021042413A	2021-03-18
CN205954090U	2017-02-15
KR20150010052A	2015-01-28
KR20040056235A	2004-06-30
KR101008184B1	2011-01-14
KR101061905B1	2011-09-02
JP2012021183A	2012-02-02
KR20120011362A	2012-02-08
KR20140066435A	2014-06-02
KR20150010052A	2015-01-28
KR101696734B1	2017-01-17
KR101746772B1	2017-06-13

PARK, Keon Woo et al. (KR)

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