Title:
BALL GRID ARRAY (BGA) CONNECTION SYSTEM AND RELATED METHOD AND BALL SOCKET
Document Type and Number:
WIPO Patent Application WO2008005989
Kind Code:
B1
Abstract:
A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.
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Inventors:
SMITH STEVEN C (US)
SNYDER STEVEN R (US)
SNYDER STEVEN R (US)
Application Number:
PCT/US2007/072758
Publication Date:
March 06, 2008
Filing Date:
July 03, 2007
Export Citation:
Assignee:
HARRIS CORP (US)
International Classes:
H05K3/34; H01R12/55
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