Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BALL JOINT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2019/117627
Kind Code:
A1
Abstract:
A ball joint assembly according to an embodiment of the present disclosure comprises: a ball stud including a spherical ball and a rod that extends upward from the ball; a bearing in which the ball is accommodated; a case including an inner circumferential surface, which is spaced apart from an outer circumferential surface of the bearing, and a stopper for supporting an upper end of the bearing; and an insert molding part which fills a gap between the outer circumferential surface of the bearing and the inner circumferential surface of the case, and which is formed to surround a lower section of the bearing and at least a portion of a lower section of the case, thereby fixing the bearing to the case.

Inventors:
LEE BYUNG KWAN (KR)
SON KWANG RAK (KR)
Application Number:
PCT/KR2018/015791
Publication Date:
June 20, 2019
Filing Date:
December 12, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ILJIN CO LTD (KR)
International Classes:
B60G7/00; F16C11/06; F16C33/04
Foreign References:
KR20170098365A2017-08-30
JP2006105306A2006-04-20
JPH039113A1991-01-17
JPH09166130A1997-06-24
JP2012052602A2012-03-15
Attorney, Agent or Firm:
MOA INTELLECTUAL PROPERTY LAW FIRM (KR)
Download PDF: