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Title:
BAMBOO PLATE MANUFACTURING METHOD, BAMBOO PLATE CONTINUOUS CUTTING DEVICE, AND BAMBOO PLATE OBTAINED FROM THESE METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/1999/044796
Kind Code:
A1
Abstract:
A bamboo plate manufacturing method and a bamboo plate manufacturing device, wherein, using plates (3, 4) formed by dividing a bamboo material in longitudinal direction and expanding it after the joints and bark on the inside and outside thereof are removed or plates (7) formed by dividing a bamboo material in longitudinal direction, finely dividing it in circumferential direction, and cutting the four surfaces of the arc section thereof, (A) the plates (3, 4, 7) are arranged in longitudinal and lateral directions and laminated in thickness direction with adhesive agent (5), (B) the laminated surfaces are pressurized and dried to form laminated materials (1, 2, 6), and (C) the laminated materials (1, 2, 6) are mounted on a moving part with a pressing and feeding mechanism thereon and, while being held by the moving part and a corresponding fixed part, they are pressed against a cutting part with an endless band saw (28) and moved longitudinally in the direction vertical to or in parallel with the bonding surface of the laminated materials for cutting so as to form a bamboo plate of any thickness.

Inventors:
YOSHIDA SEIJI (JP)
Application Number:
PCT/JP1999/001037
Publication Date:
September 10, 1999
Filing Date:
March 03, 1999
Export Citation:
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Assignee:
JAPAN BLOWER IND CO LTD (JP)
YOSHIDA SEIJI (JP)
International Classes:
B23D53/06; B23D55/04; B27M1/08; B27M3/00; (IPC1-7): B27J1/00; B27B13/00; B27M1/00; B27M3/00
Foreign References:
JPH02115404U1990-09-14
JPS61100504U1986-06-27
JPS4742921A
JPH091509A1997-01-07
JPS6078292U1985-05-31
JPH0269201A1990-03-08
JPH09503166A1997-03-31
Attorney, Agent or Firm:
Takeuchi, Takashi (Kitahama 3-chome Chuo-ku, Osaka-shi Osaka, JP)
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