BAND ASSEMBLY - SAMSUNG SDI CO LTD

Title:

BAND ASSEMBLY

Document Type and Number:

WIPO Patent Application WO/2018/043783

Kind Code:

A1

Abstract:

The present disclosure relates to a band assembly comprising: a first outer connection part including a first fastening hole and a second outer connection part including a third fastening hole, the first and second outer connection parts being arranged opposite to each other; an inner connection part disposed between the first outer connection part and the second outer connection part and including a second fastening hole corresponding to the first fastening hole and the third fastening hole; and a secondary battery inserted into the first fastening hole, the second fastening hole, and the third fastening hole so as to connect the first outer connection part, the inner connection part, and the second outer connection part.

Inventors:

CHOI SOL (KR)
KIM JAN-DEE (KR)
NAM JUNG-GYU (KR)
PARK BONG-KYOUNG (KR)
SUH JUN-WON (KR)
SOHN JU-HEE (KR)
YANG JUNGYUP (KR)
YI JEONG-DOO (KR)
HAN JU-HYEONG (KR)
SONG HYUN-HWA (KR)
EOM HYE-RI (KR)
HAN DA-WOON (KR)
HONG SEOK-HUN (KR)

Application Number:

PCT/KR2016/010033

Publication Date:

March 08, 2018

Filing Date:

September 07, 2016

Export Citation:

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Assignee:

SAMSUNG SDI CO LTD (KR)

International Classes:

H01M10/0587; H01M50/179; H01M50/213; H01M50/247; H01M50/503; H01M50/531; H01M50/559

Foreign References:

JPH07322905A	1995-12-12
US5615179A	1997-03-25
US5695885A	1997-12-09
US20150115870A1	2015-04-30
US20110089903A1	2011-04-21

Other References: