BAND PLATE BENDING APPARATUS - MIZUKAWA SUEHIRO

Title:

BAND PLATE BENDING APPARATUS

Document Type and Number:

WIPO Patent Application WO/1995/000266

Kind Code:

A1

Abstract:

This invention relates to an apparatus A for bending a band plate (100), such as a band edge, in which a fixed mold (1) having a slit (11) through which the band plate (100) is passed is provided unitarily with a shaft (3), a movable mold (2) for bending the band plate (100) in cooperation with the fixed mold (1) being cylindrically formed, a rotational force being transmitted from an electric motor (5) to one end portion only of the movable mold (2). The shaft (3) is fastened at its lower portion to a machine base (4) with bolts (85) via a mount member (8), whereby the changing of the fixed mold (1) can be done easily. In order to change the fixed mold (1) for another, the bolts (85) are removed, and the shaft (3) is drawn out along with the mount member (8) toward the lower side of the machine base (4), another shaft being inserted from the lower side of the machine base to fix the mount member to the machine base by using the bolts.

Inventors:

MIZUKAWA SUEHIRO (JP)
OHTANI SUSUMU (JP)
OGAWA NAOKI (JP)

Application Number:

PCT/JP1993/000818

Publication Date:

January 05, 1995

Filing Date:

June 17, 1993

Export Citation:

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Assignee:

MIZUKAWA SUEHIRO (JP)
OHTANI SUSUMU (JP)
OGAWA NAOKI (JP)

International Classes:

B21D5/01; B21D5/04; B21D7/024; B21D37/20; B21D53/64; (IPC1-7): B21D5/01; B21D7/024

Foreign References:

JPS63309328A

1988-12-16

Other References: