Title:
BAND PLATE BENDING METHOD, AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2008/029444
Kind Code:
A1
Abstract:
Provided is a band plate bending method for enabling a fine and complex bending
work to make a small bend of a small radius of curvature. The individual leading
end portions (4a, 5a) of a pair of pawl members (4, 5) are so arranged on the two sides
of the vicinity of an exit-side open end (8a) of an insertion hole (8) of a guide
nozzle (3) as are individually close to the two thickness-direction side faces
of a band plate (2) protruding from the exit-side open end (8a) of the insertion
hole (8). The paired pawl members (4, 5) are simultaneously turned in the same
direction around the center point (0) between the leading end portions (4a, 5a)
of the paired pawl members (4, 5) so that the individual leading end portions (4a,
5a) may be individually brought into abutment, on the action lines of couple of
forces, against the two thickness-direction sides of the band plate (2). Subsequently,
the pawl members (4, 5) are simultaneously turned in the same direction on the
center point (0) thereby to bend the band plate (2).
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Inventors:
MIZUKAWA SUEHIRO (JP)
Application Number:
PCT/JP2006/317505
Publication Date:
March 13, 2008
Filing Date:
September 05, 2006
Export Citation:
Assignee:
MIZUKAWA SUEHIRO (JP)
International Classes:
B21D5/04; B21D7/024; B21D53/64
Foreign References:
| JP3036096U | 1997-04-08 | |||
| JP2006272414A | 2006-10-12 | |||
| JP2006055896A | 2006-03-02 | |||
| JPH06226351A | 1994-08-16 |
Attorney, Agent or Firm:
SUZUE, Shoji et al. (5-15 Taiyujicho, Kita-k, Osaka-shi Osaka, JP)
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