Title:
BAND SAW CUTTING DEVICE AND INGOT CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/076905
Kind Code:
A1
Abstract:
The invention is a band saw cutting device that cuts an ingot by guiding a circularly driven blade using static pressure pads while propelling the blade downward relative to the ingot from above same. The band saw cutting device is characterized: in comprising a driving unit that moves the static pressure pads in the front-back direction with respect to the blade circling direction, and a control unit that controls the movement distance and movement speed of the static pressure pads by the driving unit; and in the device controlling the movement of the static pressure pads with the control unit while cutting the ingot. Provided thereby are a band saw cutting device and ingot cutting method which are able to stably limit blade displacement during cutting, stably maintain the quality of the cut surface of an ingot block or a crystal quality evaluation sample wafer cut therewith, prolong blade life, and improve cutting speed.
Inventors:
NAKAGAWA KAZUYA (JP)
Application Number:
PCT/JP2012/006576
Publication Date:
May 30, 2013
Filing Date:
October 15, 2012
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B28D5/04; B24B27/06; H01L21/304
Domestic Patent References:
| WO2009081524A1 | 2009-07-02 |
Foreign References:
| JPS6067021A | 1985-04-17 | |||
| JP2010214497A | 2010-09-30 | |||
| JP2010114286A | 2010-05-20 | |||
| JP2000334653A | 2000-12-05 | |||
| JPS6458472A | 1989-03-06 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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