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Patent Searching and Data


Title:
BAND SAW CUTTING DEVICE AND METHOD OF CUTTING INGOT
Document Type and Number:
WIPO Patent Application WO/2010/032371
Kind Code:
A1
Abstract:
Disclosed are a band saw cutting device in which an ingot is horizontally mounted on a cutting table and a blade having the shape of an endless belt and consisting of an abrasive grain portion and a core is stretched between pulleys, and which has an outlet for jetting a coolant to the blade and feeds the blade being driven to circulate by rotation of the pulleys, relatively from up to down to thereby cut the ingot, and a cutting method for the band saw cutting device.  The band saw cutting device is characterized in that the pulley is configured to rotate about the axis thereof in the opposite directions, and the ingot can be cut by changing the circulation drive direction of the blade.  Consequently, the quality of an ingot to be cut can be maintained stably, the lifetime of the blade is prolonged, and productivity is enhanced.

Inventors:
NISHINO, Hidehiko (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
西野英彦 (〒61 福島県西白河郡西郷村大字小田倉字大平150番地信越半導体株式会社 白河工場内 Fukushima, 〒9618061, JP)
HIRANO, Yoshihiro (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2009/003876
Publication Date:
March 25, 2010
Filing Date:
August 12, 2009
Export Citation:
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Assignee:
Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目6番2号 Tokyo, 〒1000004, JP)
NISHINO, Hidehiko (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
西野英彦 (〒61 福島県西白河郡西郷村大字小田倉字大平150番地信越半導体株式会社 白河工場内 Fukushima, 〒9618061, JP)
International Classes:
H01L21/304; B23D55/08; B24B21/20; B28D5/04
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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