Title:
BAND SAW AND METHOD OF MANUFACTURING BAND SAW
Document Type and Number:
WIPO Patent Application WO/2006/123652
Kind Code:
A1
Abstract:
A band saw and a method of manufacturing the band saw. The band saw comprises a band-like flat plate-shaped base metal (1) and a blade part (4) formed by fixing abrasive grains to one end edge part (3) of two end edge parts (2) and (3) extending in the longitudinal direction of the base metal (1). Recessed patterns are formed in one surface of the two surfaces of the base metal (1). Projected patterns are formed on the other surface at positions facing the recessed patterns. Thus, the band saw having excellent rigidity, excellent sharpness, and high cutting accuracy can be provided.
Inventors:
TAKANO SEIKI (JP)
Application Number:
PCT/JP2006/309730
Publication Date:
November 23, 2006
Filing Date:
May 16, 2006
Export Citation:
Assignee:
ASAHI DIAMOND IND (JP)
TAKANO SEIKI (JP)
TAKANO SEIKI (JP)
International Classes:
B23D61/12; B24D99/00
Foreign References:
| JPS6334078A | 1988-02-13 | |||
| JPS63300874A | 1988-12-08 | |||
| JP2002113612A | 2002-04-16 |
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza 1-chom, Chuo-ku Tokyo 61, JP)
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