BANKNOTE BINDING DEVICE, BANKNOTE BINDING METHOD, AND BANKNOTE BINDING SYSTEM

WIPO Patent Application WO/2010/103620

A1

A banknote binding device (3) which forms a bound banknote bundle by binding, by using a binding band,one hundred banknotes having a specific denomination among banknotes. The banknote binding device (3) has a marking number recognizing section (16) for acquiring for each banknote a marking number for discriminating the banknote, a bundle ID creating section (183) for creating for each bound banknote bundle an bundle ID relating to marking numbers of the banknotes in the bound banknote bundle, and a printing controlling section (184) for driving and controlling a printer (55) in order to print on the binding band the bundle ID created by the bundle ID creating section (183). The construction allows a user of the device to sufficiently cope with unreasonable complaints for a correct banknote bundle.

JP09226716	METHOD FOR PACKING LAMINATED METAL SHEETS AND PACKAGE THEREOF
JP59128158	PROCESSOR OF FOLD SHEET BEFORE ITS BINDING
JP01153419	AUTOMATIC STACKING BUNDLING MACHINE FOR BOX SHAPED CONTAINER

ITO, Osamu (3-1 Shimoteno 1-chome, Himeji-sh, Hyogo 67, 67085, JP)
伊藤 治 (〒67 兵庫県姫路市下手野一丁目３番１号 グローリー株式会社内 Hyogo, 67085, JP)

JP2009/054560

September 16, 2010

March 10, 2009

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GLORY LTD. (3-1 Shimoteno 1-chome, Himeji-shi Hyogo, 67, 67085, JP)
グローリー株式会社 (〒67 兵庫県姫路市下手野一丁目３番１号 Hyogo, 67085, JP)
ITO, Osamu (3-1 Shimoteno 1-chome, Himeji-sh, Hyogo 67, 67085, JP)

B65B27/08

NAKATSUJI, Shiro (Sakai International Patent Office, Kasumigaseki Building 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 10060, JP)

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