Title:
BASE BOARD MODULE
Document Type and Number:
WIPO Patent Application WO/2018/163315
Kind Code:
A1
Abstract:
In this invention, a printed circuit board (3) has a conductor-less region (30) wherein a conductor has been excluded over the entirety of an edge on the side where a coaxial connector (2) is mounted. An end section of a core wire (22) contacts a signal pad (35) while in a state of being covered by a second ground conductor part (21) of the coaxial connector (2) mounted on the conductor-less region (30).
Inventors:
OKANAMI YUKI (JP)
ITAKURA HIROSHI (JP)
AKEBOSHI YOSHIHIRO (JP)
ITAKURA HIROSHI (JP)
AKEBOSHI YOSHIHIRO (JP)
Application Number:
PCT/JP2017/009226
Publication Date:
September 13, 2018
Filing Date:
March 08, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01R24/42; H01R12/71
Foreign References:
| JP2010244900A | 2010-10-28 | |||
| JP2011096752A | 2011-05-12 | |||
| JPS6399402U | 1988-06-28 | |||
| JP2016127008A | 2016-07-11 | |||
| US20160079693A1 | 2016-03-17 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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