Title:
BASE MATERIAL FOR ADHESIVE SHEET, AND ADHESIVE SHEET FOR PROCESSING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/031543
Kind Code:
A1
Abstract:
A base material (1) for an adhesive sheet, the base material being used for processing an electronic component, has: a polyester film (11) having a first film surface (11A) and a second film surface (11B); a first oligomer sealing layer (21); and a second oligomer sealing layer (22). The polyester film (11) is fully annealed. The first oligomer sealing layer (21) and the second oligomer sealing layer (22) each independently are cured films obtained by curing a composition for forming an oligomer sealing layer, the composition containing a curable component. The first oligomer sealing layer (21) and the second oligomer sealing layer (22) contain substantially no filler. The root mean square height Rq1 of a first base material surface (21A) of the first oligomer sealing layer (21), and/or the root mean square height Rq2 of a second base material surface (22A) of the second oligomer sealing layer (22), is 0.031 μm or greater.
Inventors:
TAKANO KEN (JP)
Application Number:
PCT/JP2019/025768
Publication Date:
February 13, 2020
Filing Date:
June 28, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/56; C09J4/06; C09J7/29; C09J7/38; C09J133/00; H01L21/52
Domestic Patent References:
| WO2017038917A1 | 2017-03-09 |
Foreign References:
| JP2014193527A | 2014-10-09 | |||
| JP2015074732A | 2015-04-20 | |||
| JP2014177521A | 2014-09-25 | |||
| JP2012255138A | 2012-12-27 | |||
| JP2005236082A | 2005-09-02 | |||
| JP2018009060A | 2018-01-18 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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