Title:
BASE MATERIAL FILM FOR SEMICONDUCTOR PROCESSING SHEET, SEMICONDUCTOR PROCESSING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/015012
Kind Code:
A1
Abstract:
A semiconductor processing sheet (1) is provided with: a base material film (2), which is configured of a resin layer (A) composed of a resin composition containing 10-70 mass % of an olefin resin having a resin density of 0.870-0.900 g/cm3, and a heat flow of 2.5 W/g or less at a melting peak; and an adhesive layer (3) that is laminated on one surface of the base material film (2). The semiconductor processing sheet (1) has excellent pickup performance, and suppresses deterioration of the pickup performance with time.
Inventors:
TAYA NAOKI (JP)
UEDA MASASHI (JP)
ICHIKAWA ISAO (JP)
FURUDATE MASAAKI (JP)
UEDA MASASHI (JP)
ICHIKAWA ISAO (JP)
FURUDATE MASAAKI (JP)
Application Number:
PCT/JP2012/063763
Publication Date:
January 31, 2013
Filing Date:
May 29, 2012
Export Citation:
Assignee:
LINTEC CORP (JP)
TAYA NAOKI (JP)
UEDA MASASHI (JP)
ICHIKAWA ISAO (JP)
FURUDATE MASAAKI (JP)
TAYA NAOKI (JP)
UEDA MASASHI (JP)
ICHIKAWA ISAO (JP)
FURUDATE MASAAKI (JP)
International Classes:
H01L21/301; C09J7/29; C09J11/06; C09J133/00; C09J163/00; H01L21/52
Foreign References:
| JPH11189755A | 1999-07-13 | |||
| JP2008004836A | 2008-01-10 | |||
| JP2011216508A | 2011-10-27 |
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)
Yuji Hayakawa (JP)
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Claims: