Title:
BASE MATERIAL FILM AND WORKPIECE PROCESSING SHEET
Document Type and Number:
WIPO Patent Application WO/2023/054299
Kind Code:
A1
Abstract:
This base material film comprises a first resin layer containing a polyester resin and a polymeric antistatic agent. The polyester resin has an alicyclic structure, and the heat of fusion thereof as measured by differential scanning calorimetry at a temperature increase rate of 20°C/min is 2 J/g or higher. The polymeric antistatic agent contains a polymeric compound and an organic salt constituted of an organic cation and an organic anion, and does not substantially contain an alkaline metal salt or an alkaline earth metal salt. The surface resistivity on at least one surface of the base material film is 1×106Ω/□ to 1×1015Ω/□. This base material film has excellent dust adhesion prevention characteristics and suppresses the generation of impurity ions while also sufficiently suppressing the occurrence of chips.
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Inventors:
HARA YUSUKE (JP)
SASAKI HARUKA (JP)
SASAKI HARUKA (JP)
Application Number:
PCT/JP2022/035816
Publication Date:
April 06, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08J5/18; B32B27/18; B32B27/36; C08L67/00; H01L21/301
Domestic Patent References:
| WO2021200615A1 | 2021-10-07 | |||
| WO2021200616A1 | 2021-10-07 | |||
| WO2022201656A1 | 2022-09-29 |
Foreign References:
| JP2006282798A | 2006-10-19 | |||
| JP2016069600A | 2016-05-09 | |||
| JP2005313450A | 2005-11-10 | |||
| JP2017063210A | 2017-03-30 | |||
| JP2020084143A | 2020-06-04 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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