BASE MATERIAL PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

WIPO Patent Application WO/2014/115468

A1

Provided is a base material particle that, when electrically connecting electrodes using conductive particles having a conductive layer formed at the surface thereof, can reduce connection resistance and can suppress connection defects resulting from spring back and connection defects resulting from the occurrence of cracks in the electrodes. The base material particle (11) has a conductive layer (2) formed at the surface thereof and is used for obtaining conductive particles (1) having a conductive layer (2). The base material particle (11) is a core-shell particle provided with a core (12) and a shell (13) disposed on the surface of the core (12). The compression recovery rate of the base material particle (11) is less than 50%. The compression modulus of elasticity of the base material particle (11) when compressed by 10% is at least 3000 N/mm2 and less than 6000 N/mm2. The ratio of the load value when the base material particle (1) is compressed by 30% with respect to the load value when compressed by 10% is no greater than 3.

NAGAI YASUHIKO (JP)
UENOYAMA SHINYA (JP)
WANG XIAOGE (JP)
YAMADA YASUYUKI (JP)

PCT/JP2013/084488

July 31, 2014

December 24, 2013

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SEKISUI CHEMICAL CO LTD (JP)

H01B5/00; C09J9/02; C09J11/00; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01

JP2012209097A	2012-10-25
JP2011094146A	2011-05-12
JP2011060502A	2011-03-24
JP2012185918A	2012-09-27
JP2011243456A	2011-12-01

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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