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Patent Searching and Data


Title:
BASE MATERIAL PROCESSING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/187769
Kind Code:
A1
Abstract:
[Problem] To provide a method for processing or moving a base material temporarily fixed on a support member via a temporary fixing material, the method enabling the base material to be positioned on the support member in a satisfactory manner. [Solution] A base material processing method comprises: a step (1) in which a structure (I) comprising a base material and an adhesive layer and a structure (II) comprising a support member, an optical absorption layer on the support member, and a metal-containing layer on the optical absorption layer are affixed to each other in such a way that the adhesive layer and the metal-containing layer are opposed to each other, thereby forming a stacked body comprising, in this order in a stacked direction, the base material, the adhesive layer, the metal-containing layer, the optical absorption layer, and the support member, wherein the affixing is performed after the structures (I) and (II) are positioned on the basis of positional information of the structure (II) obtained by irradiation with measurement light; a step (2) in which the base material is processed and/or the stacked body is moved; a step (3) in which the optical absorption layer is irradiated with light; and a step (4) in which the base material is separated from the support member.

Inventors:
OOKITA KENZOU (JP)
MATSUMOTO TAICHI (JP)
WATANABE KAZUTO (JP)
MORI TAKASHI (JP)
MIZUNO HIKARU (JP)
Application Number:
PCT/JP2017/007840
Publication Date:
November 02, 2017
Filing Date:
February 28, 2017
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
H01L21/02; B23K26/03; B23K26/18; B23K26/57
Domestic Patent References:
WO2015029577A12015-03-05
Foreign References:
JPH10125929A1998-05-15
JP2014112618A2014-06-19
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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