Title:
BASE PLATE, AND SEMICONDUCTOR DEVICE PROVIDED WITH BASE PLATE
Document Type and Number:
WIPO Patent Application WO/2015/080161
Kind Code:
A1
Abstract:
A base plate in which a member to be joined is joined to one mounting surface via a joining material, wherein the joining position of the mounting surface, to which the member to be joined is joined, is provided with a concave for joining the member to be joined via the joining material. The concave is configured so that the area of the opening thereof is greater than the member to be joined, and the depression at the outer circumferential part of the concave, which faces the outer circumferential edge of the member to be joined, is deeper than the depression at the central part of the concave.
Inventors:
TAO HIROAKI
ICHIHARA CHIKARA
JIKO NORIHIRO
TAUCHI YUKI
MITSUI TOSHIYUKI
ICHIHARA CHIKARA
JIKO NORIHIRO
TAUCHI YUKI
MITSUI TOSHIYUKI
Application Number:
PCT/JP2014/081268
Publication Date:
June 04, 2015
Filing Date:
November 26, 2014
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
SHINKO LEADMIKK CO LTD (JP)
SHINKO LEADMIKK CO LTD (JP)
International Classes:
H01L23/12; B23K1/00; H01L21/52; H01L23/36; H01L23/48; B23K101/40
Foreign References:
| JP2012104709A | 2012-05-31 | |||
| JP2009094157A | 2009-04-30 | |||
| JP2013229363A | 2013-11-07 | |||
| JPH10189845A | 1998-07-21 | |||
| JP2007110001A | 2007-04-26 | |||
| JP2009070907A | 2009-04-02 | |||
| JP2013123016A | 2013-06-20 | |||
| JPH0637122A | 1994-02-10 | |||
| JP2010062203A | 2010-03-18 | |||
| JP2006140402A | 2006-06-01 | |||
| JP2009272487A | 2009-11-19 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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