Title:
BATTERY MODULE, METHOD FOR MANUFACTURING SAME, AND TEMPERATURE ADJUSTMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2011/033722
Kind Code:
A1
Abstract:
A temperature adjustment unit (5) comprises a resin molding body in which a first plane portion (73), a second plane portion (75), and a side-wall portion (77) are integrally formed, and is partitioned by the side-wall portion (77) into a holding portion (81) and a flow channel (85). A unit cell (21) is closely contacted to and held by the holding portion (81) partitioned by the side-wall portion (77).
Inventors:
ITOI TOSHIKI
YASUI SHUNSUKE
TAKASAKI HIROSHI
YASUI SHUNSUKE
TAKASAKI HIROSHI
Application Number:
PCT/JP2010/005133
Publication Date:
March 24, 2011
Filing Date:
August 19, 2010
Export Citation:
Assignee:
PANASONIC CORP (JP)
ITOI TOSHIKI
YASUI SHUNSUKE
TAKASAKI HIROSHI
ITOI TOSHIKI
YASUI SHUNSUKE
TAKASAKI HIROSHI
International Classes:
H01M10/60; H01M10/613; H01M10/615; H01M10/617; H01M10/625; H01M10/643; H01M10/652; H01M10/6557; H01M10/6568; H01M50/213; H01M50/227; H01M50/271; H01M50/505; H01M50/509; H01M50/524
Foreign References:
| JP2006128124A | 2006-05-18 | |||
| JPH10106521A | 1998-04-24 | |||
| JP2000306560A | 2000-11-02 | |||
| JP2004185867A | 2004-07-02 | |||
| JP2006331956A | 2006-12-07 | |||
| JP2004171856A | 2004-06-17 | |||
| JP2009193961A | 2009-08-27 | |||
| JP2000133225A | 2000-05-12 | |||
| JP2003291656A | 2003-10-15 | |||
| JP2000251951A | 2000-09-14 | |||
| JPH1154157A | 1999-02-26 |
Other References:
See also references of EP 2339688A4
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
Hiroshi Maeda (JP)
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