Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BEAM WELDING METHOD, VACUUM PACKAGING METHOD, AND VACUUM HEAT-INSULATION MATERIAL PRODUCED BY VACUUM PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/145481
Kind Code:
A1
Abstract:
The disclosed beam welding method involves: a metal-foil layering step of mounting a first metal foil and a second metal foil placed on the first metal foil on both a primary mounting surface and a secondary mounting surface of a support mount which are located adjacent to one another; a tight contact step of bringing the portions of the first and second metal foils mounted on the primary mounting surface into tight contact with one another along an imaginary welding line, with the portions of the first and second metal foils mounted on the secondary mounting surface being kept in a free state; and a welding-and-cutting step of cutting off the portions of the first and second metal foils mounted on the secondary mounting surface while welding together the portions of the first and second metal foils mounted on the primary mounting surface along the imaginary welding line by heating the first and second metal foils through convergent irradiation with an electron beam in a predetermined vacuum environment after the tight contact step.

Inventors:
SHINOKI TOSHIO (JP)
SEKINE KATSUNORI (JP)
YATO MASAKI (JP)
HANAI MASAHIRO (JP)
Application Number:
PCT/JP2011/060767
Publication Date:
November 24, 2011
Filing Date:
May 10, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
SHINOKI TOSHIO (JP)
SEKINE KATSUNORI (JP)
YATO MASAKI (JP)
HANAI MASAHIRO (JP)
International Classes:
B23K15/00; B23K15/08; B23K26/10; B23K26/20; B23K26/38; F16L59/06
Foreign References:
JPS6448690A1989-02-23
JPH0360886A1991-03-15
JPH03106576A1991-05-07
JPH04298244A1992-10-22
JPH0929466A1997-02-04
JPH0985478A1997-03-31
JPH0989480A1997-04-04
JPH09220639A1997-08-26
JP2005118849A2005-05-12
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
Download PDF:
Claims: