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Patent Searching and Data


Title:
BEARING PRELOADING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/072352
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a bearing preloading device with which a helical compression spring can easily be prevented from falling out, without the use of a special component used for retaining the helical compression spring. Holes (25) are formed in a bearing ring (5) or another member (15) opposing the bearing ring (5) in the axial direction. The inner circumference of the holes (25) is formed with a threaded section (22) extending to the bottom surface of the hole, and a shallow hole section (26) having a larger inner diameter than that of the threaded section (22) and extending to the rim of the hole. A helical compression spring (21) can be screwed into the threaded section (22) from the axial direction. The shallow hole section (26) is set so as to be concentric with the threaded portion (22) and have a larger inner diameter than the outer diameter of the helical compression spring (21). The natural length of the springs (21) is set such that the spring protrudes from the shallow hole section (26) in the axial direction. The axial length of the shallow hole section (26) is set such that the spring (21) can be compressed so as to be contained within the hole (25).

Inventors:
SHIMIZU Yasuhiro (3066 Aza Oyumida, Oaza Higashikata, Kuwana-sh, Mie 11, 〒5110811, JP)
Application Number:
JP2014/079051
Publication Date:
May 21, 2015
Filing Date:
October 31, 2014
Export Citation:
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Assignee:
NTN CORPORATION (3-17, Kyomachibori 1-chome Nishi-ku, Osaka-sh, Osaka 03, 〒5500003, JP)
International Classes:
F16C25/08; F16C19/38; F16C33/64
Foreign References:
JP2006162011A2006-06-22
JP2006194418A2006-07-27
JP2003307210A2003-10-31
JPS5925708U1984-02-17
JP2007285384A2007-11-01
JPH01269714A1989-10-27
DE102004048720A12006-04-13
DE499877C1930-06-14
JP4746469B22011-08-10
Other References:
See also references of EP 3070351A4
Attorney, Agent or Firm:
KAMADA Naoya et al. (18-12, Nipponbashi 1-chome Chuo-ku, Osaka-sh, Osaka 73, 〒5420073, JP)
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