RELATED METHODS

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority benefit of U.S. Provisional Patent Application No. 63/218,490 filed July 5, 2021, and entitled Bedding Systems Based on Localized Climate Control, and Related Methods, the entire content of which is hereby expressly incorporated herein by reference in its entirety.

FIELD OF THE DISCLOSURE

[0002] The present disclosure generally relates to bedding systems, and related methods, and more particularly to bedding systems based on localized climate control and related methods.

BACKGROUND

[0003] Many factors affect the comfort of a person. One factor is the temperature of the environment in which the person is located, and whether the person feels too hot or too cold. Some individuals may feel discomfort sitting, laying, resting, or sleeping on various items, especially items that may mirror the ambient temperature of the surroundings. In order to improve their comfort levels, individuals may try to use blankets, cooling fans, space heaters, air conditioning units, furnaces, cooling pads, etc. However, it can be expensive to heat or cool the entire environment in which the individual is located. Additionally, individuals may need blankets of various thicknesses and materials, multiple layers of blankets, or space heaters to feel warm. Alternatively, cooling pads or cooling fans may be needed to help the individuals feel cool. Oftentimes, in climates with warm or hot summers and cool or cold winters, individuals will have all of the aforementioned items for use during different times of the year.

[0004] Additionally, some individuals may have physiological or psychological benefits if they are able to regulate their body temperature. For instance, some individuals may use heating pads to ease muscle aches, joint pain, and soft-tissue strain, improve blood circulation, and facilitate healing from an injury. Cooling pads may be used to reduce swelling, inflammation, and muscle soreness due to injury.

[0005] Existing technologies for heating or cooling may be active or passive. Existing technologies for passively heating or cooling an individual may often be insufficient and obtaining a comfortable body temperature can be difficult to achieve, especially over prolonged periods of time.

[0006] Further, existing bedding system technologies for heating or cooling an individual can only perform either heating or cooling, but are not capable of both heating and cooling. For example, electrical heating blankets (and clothing) include electrically resistive heating elements incorporated therein that, when electrically coupled to an electric source (i.e., a voltage or current is drawn thereacross), the heating elements increase in temperature to relatively high temperatures (above the temperature of the user). As another example, existing bedding systems use various cooling technologies to cool the bedding systems, for example, forced air or water circulation is used to transfer heat away from a user. As such, the comfort level of a user cannot be precisely regulated and controlled to a desired degree of comfort level.

[0007] Therefore, a need exists in the art for bedding systems that can precisely regulate local climate environments of a user.

[0008] While certain aspects of conventional technologies have been discussed to facilitate disclosure of the present invention, in no way are technical aspects that are not described disclaimed and it is contemplated that the claimed invention may encompass one or more of the technical aspects discussed herein.

[0009] In this specification, where a document, act or item of knowledge is referred to or discussed, this reference or discussion is not an admission that the document, act or item of knowledge or any combination thereof was, at the priority date, publicly available, known to the public, part of common general knowledge, or otherwise constitutes prior art under the applicable statutory provisions; or is known to be relevant in an attempt to solve any problem with which this specification is concerned.

SUMMARY

[0010] Shortcomings of the prior art are overcome and additional advantages are provided through improved bedding systems including mattress, cushions, and body-support pads or mats disclosed herein. The presently described mattresses, cushions, and body-support pads or mats address one or more of the problems and deficiencies of the art discussed above. However, it is contemplated that the disclosed mattresses, cushions, and body-support pads or mats may prove useful in addressing other problems and deficiencies in a number of technical areas. Therefore, the disclosed mattresses, cushions, and body-support pads or mats should not necessarily be construed as limited to addressing any of the particular problems or deficiencies discussed herein.

[0011] Certain embodiments of the presently disclosed bedding systems have several features, no single one of which is solely responsible for their desirable attributes. Without limiting the scope of the presently disclosed bedding systems as defined by the claims that follow, the more prominent features of these items will now be discussed briefly.

[0012] In one aspect, disclosed herein is a bedding system. The bedding system includes a first flexible layer, a second flexible layer, and at least one localized climate regulation element disposed between the first flexible layer and the second flexible layer. The at least one localized climate regulation element is configured to reduce a temperature of one of the first and second flexible layers and to increase a temperature of the other one of the first and second flexible layers. The at least one localized climate regulation element is a Peltier effect element comprising an N-type semiconductor leg and a P-type semiconductor leg. One end of the N-type semiconductor leg is electrically connected to one end of the P-type semiconductor leg, such that the at least one localized climate regulation element is electrically connected in series and thermally in parallel.

[0013] In another aspect, disclosed herein is a method of manufacturing a bedding system. The method comprises providing a first flexible layer and a second flexible layer; depositing an electrical insulation layer on each of the first and second flexible layers; forming electrical interconnects on the electrical insulation layers on the first and second flexible layers; forming N-type and P-type semiconductor legs and insulation layers between the N-type and P-type semiconductor legs on the first flexible layers; and laminating the second flexible layer on the first flexible layer, such that the N-type and P-type semiconductor legs and insulation layers between the N-type and P-type semiconductor legs are disposed between the first flexible layer and the second flexible layer, and the electrical interconnects on the electrical insulation layer of the second flexible layer would electrically contact the corresponding N-type and P-type semiconductor legs.

[0014] In another aspect, disclosed herein is a method of using a bedding system for regulating localized climate of a user. The method comprises providing the bedding system to the user; providing a remote control to the user, the remote control configured to be in data communication with a control device coupled to the bedding system; selecting a desired temperature on the remote control; receiving a temperature detected by the at least one temperature sensor of the bedding system, wherein the temperature detected is a temperature of a portion of the bedding system proximal to the user; transmitting a communication signal corresponding to the desired temperature to the control device; comparing the desired temperature and the detected temperature; in determination that the detected temperature is greater than the desired temperature, supplying an electrical current to the at least one localized climate regulation element of the bedding system, such that the side of the at least one localized climate regulation element proximal to the user is being controllably cooled to the desired temperature; and in determination that the detected temperature is less than the desired temperature, supplying an electrical current to the at least one localized climate regulation element of the bedding system, such that the side of the at least one localized climate regulation element proximal to the user is being controllably heated to the desired temperature.

[0015] These and other features and advantages of the disclosure and inventions will become apparent from the following detailed description of the various aspects of the invention taken in conjunction with the appended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Aspects described herein are particularly pointed out and distinctly claimed as examples in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the disclosure are apparent from the following detailed description taken in conjunction with the accompanying drawings, which are not necessarily drawn to scale, wherein: [0017] FIG. 1 A depicts a side view of an example bedding system having a localized climate regulation element based on Peltier effect, in according to one embodiment of the present disclosure.

[0018] FIG. IB depicts a perspective view of the example bedding system in FIG. 1 A, in according to one embodiment of the present disclosure.

[0019] FIG. 2 depicts a side view of an example bedding system having more than one localized climate regulation elements based on Peltier effect, according to one embodiment of the present disclosure.

[0020] FIG. 3 depicts a perspective view of an example bedding system having zoned localized climate regulation elements based on Peltier effect, according to one embodiment of the present disclosure. [0021] FIG. 4 depicts a flow chart of an example method of manufacturing a bedding system having localized climate regulation elements based on Peltier effect, according to one embodiment of the present disclosure.

[0022] FIG. 5 depicts a schematic diagram of an example control device configured to control a bedding system, according to one embodiment of the present disclosure.

[0023] FIG. 6 depicts a perspective view of an example bedding system, in according to one embodiment of the present disclosure.

[0024] FIG. 7 depicts a perspective view of an example bedding system, in according to one embodiment of the present disclosure.

DETAILED DESCRIPTION

[0025] Aspects of the present disclosure and certain features, advantages, and details thereof, are explained more fully below with reference to the non-limiting embodiments illustrated in the accompanying drawings. Descriptions of well-known materials, fabrication tools, processing techniques, etc., are omitted so as to not unnecessarily obscure the details of the inventions. It should be understood, however, that the detailed description and the specific example(s), while indicating embodiments of inventions of the present disclosure, are given by way of illustration only, and are not by way of limitation. Various substitutions, modifications, additions and/or arrangements within the spirit and/or scope of the underlying inventive concepts will be apparent to those skilled in the art from this disclosure.

[0026] Approximating language, as used herein throughout disclosure, may be applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about” or “substantially,” is not limited to the precise value specified. For example, these terms can refer to less than or equal to 0.5%, greater than or equal to -0.5%. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value.

[0027] As disclosed herein, the bedding systems may include mattresses, cushions, and body- support pads or mats. As used herein, the terms “mattress,” “cushion,” “body-support cushion,” “support cushion” and “body-support pad/mat” may be used interchangeably to refer to any and all such objects having any size and shape or that are otherwise configured to and capable of supporting at least a portion of the body of a user. Although some exemplary embodiments of the disclosed body-support cushions of the present disclosure are illustrated and/or described in the form of mattresses, mattress toppers, mattress pads, body-support pillows, and/or mattress protectors and may be dimensionally sized or shaped to support the entire or the majority of the body of a user, it is contemplated that the aspects and features described therewith are equally applicable to head pillows, seat cushions, seat backs, lumbar supports, back supports, neck supports, furniture (e.g., chairs, ottomans, chair pads, couch cushions, futons, massage tables, and seats), infant carriers, protective equipment (e.g. medical pads, sports pads, helmets), leg spacers, apparel (e.g., shoe soles, insoles, sock liners, hats, and backpacks), pet accessories (e.g., pet beds, pet carrier inserts, pet apparel), exercise equipment cushions (e.g., yoga mats, gym mats), construction materials (e.g. flooring, wall panels/mats) and the like.

[0028] Further, the bedding systems as disclosed herein can also include covers (e.g. sofa covers, chair covers, mattress covers, furniture covers, slipcovers, seat covers, blanket covers, cushion covers, blankets, throws, animal (e.g., pet, livestock) covers, clothing, wraps, sleeves, bandages, apparel, clothing, etc.), cushions (e.g. pillows, seat cushions, seat supports, seat backs, furniture cushions, couch cushions, chair cushions, infant carrier cushions, neck support cushions, leg spacer cushions, bean-bag cushions, pet accessory cushions, foot cushions, etc.), and pads or mats (e.g., body pads, floor pads, mattress pads, exercise mats, healing pads, gymnastic pads, seat pads, anti-fatigue mats, carpet mats, rugs, camping mats, sleeping pads/mats, etc.) to satisfy the need for improved localized climate regulation of users (e.g., temperature).

[0029] In this disclosure, the bedding systems are provided for active cooling and heating in response to a comfort level request from a user. For example, the user may request the bedding systems to be at a desired temperature when the user is using the bedding systems. The active cooling can pump body heat away from the user, while the active heating can supply heat to the user, the combination of which can address one or more of the problems and deficiencies in the art discussed above. In particular, both the active cooling and heating can be performed on the same localized climate regulation elements incorporated in the bedding systems, which can provide a significant benefit to the user for precisely controlling or regulating the local climate environment of the user without using both dedicated heating elements for heating and dedicated cooling elements for cooling. Further, when cooling is needed, excess heat can be dissipated away from the localized climate regulation elements, for example, by solid-to-liquid phase change materials (PCM) that may be incorporated in the bedding systems, or by surrounding environment such as natural or forced airflow.

[0030] Although various feasible localized climate regulation elements can be incorporated in the bedding systems disclosed herein, specifically in this disclosure, the localized climate regulation elements are manufactured as thermoelectric cooling and heating (TECH) elements (TECH) (i.e., elements based on Peltier effect or Peltier effect elements). A TECH element is a solid-state heat pump capable of regulating temperature precisely. A significant benefit of TECH elements is that no moving parts are involved as opposed to conventional compression- based cooling and heating systems.

[0031] A TECH element is electrical current-controlled. The heat flow is directly proportional to the applied direct current (DC), heat can be added or removed with accurate control of the direction and amount of the DC electrical current (e.g., by varying DC voltage waveforms). Due to precise bidirectional heat flow control, a bedding system incorporating the TECH elements can offer a precise regulation of the localized or micro climate environment of a user who uses the bedding system. For example, a mattress incorporating the TECH elements can provide customized micro climate environments for a user lying on the mattress, such as a warm head zone, a cool torso and butt zone, and a hot leg and foot zone.

[0032] FIG. 1 A depicts a side view of an example bedding system 100 having a localized climate regulation element based on Peltier effect, in according to one embodiment of the present disclosure. In this example embodiment, the bedding system 100 comprises a first flexible layer 102, an electrical insulation layer 104 deposited on the first flexible layer 102, a thermally conductive glue layer 106 deposited on the electrical insulation layer 104, an electrical interconnects layer 108 being glued to the thermally conductive glue layer 106, an electrically conductive glue layer 110 deposited on the electrical interconnects layer 108, a n-type semiconductor leg 112, a p-type semiconductor layer 114, an electrically and thermally insulation leg or layer 113 disposed between the n-type semiconductor leg 112 and the p-type semiconductor layer 114, an electrically conductive glue layer 116, an electrical interconnects layer 118, a thermally conductive glue layer 120, an electrical insulation layer 122, a second flexible layer 124, a heat dissipation layer 126, and an electric power source 128.

[0033] The first flexible layer 102 may comprise a fabric layer, such as a woven and/or stitched fabric layer. In some embodiments, the first flexible layer 102 may comprise a fire resistant layer or sock. In some embodiments, the first flexible layer 102 may comprise a moisture resistant layer. In some embodiments, the first flexible layer 102 may comprise a foam layer, such as polyurethane foam, viscoelastic foam, and latex foam. The first flexible layer 102 is configured to be flexible and/or deformable such that it provides cushioning to a user who rests, sleeps, lies, or sits on the first flexible layer (directly or indirectly). The first flexible layer 102 may further include heat absorption or dissipation layer or materials embedded therein. The heat absorption and/or dissipation materials may include, but not limited to, cooling gels, and phase change material (PCM). The PCM takes advantage of latent heat that can be stored or released from the material over a relatively narrow temperature range. The PCM possesses the ability to change its state with a certain temperature range, for example, a range of about 6 to about 45 degrees Celsius. These materials absorb energy during a heating process as phase change takes place, and release energy to the environment during a reverse cooling process and corresponding phase change. The PCM can convert from solid to liquid state or from liquid to solid state that is suitable for the manufacturing of heat- storage and thermo-regulated textiles and clothing. The first flexible layer 102 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the first flexible layer 102 can remain sufficiently flexible and/or deformable. For example, the first flexible layer 102 may have a thickness from about 0.1 mm to about 20 mm.

[0034] The electrical insulation layer 104 is deposited on the first flexible layer 102. The electrically insulation layer 104 is preferably a thermal conductive layer, such that heat can be effectively and efficiently moved or transferred therethrough. The electrical insulation layer 104 is configured to be flexible and/or deformable, so that the electrical insulation layer 104 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting.

[0035] The electrical insulation layer 104 may comprise electrically insulating and thermally conductive materials including, but not limited to, boron nitride nanosheet (BNNS)/ionic liquid (IL)/polymer composites, boron nitride nanosheet, Alumina, BNNSs polydimethylsiloxane (PDMS) composites, silicon carbide, diamonds, aluminum nitride, thermal conductive and electrical insulating rubber composite, thermal conductive filler and polymer matrix composites, polyethylene (PE), polyvinylchloride (PVC), polypropylene (PP), polyamide (PA), polyester- resin, phenol-resin, silicon-resin, epoxy resins, silicone, ethylene propylene rubber (EPR), ethylene propylene diene monomer (EPDM), and combinations thereof.

[0036] The electrical insulation layer 104 can be formed or deposited on the first flexible layer 102 by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll-to-roll printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the electrical insulation layer 104 may be dried, sintered and/or fused. The electrical insulation layer 104 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the electrical insulation layer 104 can remain sufficiently flexible and/or deformable. For example, the electrical insulation layer 104 may have a thickness from about 0.1 mm to about 10 mm.

[0037] The thermally conductive glue layer 106 is deposited on the electrical insulation layer 104. The thermally conductive glue layer 106 is preferably electrical insulating. The thermally conductive glue layer 106 is deposited as bonding agent between the electrical insulation layer 104 and the electrical interconnects 108. The thermally conductive glue layer 106 is configured to be flexible and/or deformable, so that the thermally conductive glue layer 106 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting.

[0038] The thermally conductive glue layer 106 may comprise, but not limited to, thermally conductive epoxy adhesives, epoxy resin-based single- and two-component adhesive having non- metallic fillers, epoxy resin-based adhesive having metallic fillers, silicone thermal plaster viscous adhesive, metal oxides, silica or ceramic microspheres, and combinations thereof.

[0039] The thermally conductive glue layer 106 can be formed or deposited on the electrical insulation layer 104 by roller coating techniques, extrusion techniques, spreading, brushing, and combinations thereof. After depositing, the thermally conductive glue layer 106 may be dried, sintered and/or fused. The thermally conductive glue layer 106 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the thermally conductive glue layer 106 can remain sufficiently flexible and/or deformable. For example, the thermally conductive glue layer 106 may have a thickness from about 0.01 mm to about 2 mm.

[0040] The electrical interconnects layer 108 is glued to the thermally conductive glue layer 106. The electrical interconnects layer 108 may be formed, shaped, or configured to correspond to the horizontal cross-sections of the n-type and p-type semiconductor legs to which the electrical interconnects layer 108 is electrically connected. That is, the electrical interconnects layer 108 is configured to match the horizontal cross-sections of the n-type and p-type semiconductor legs to which the electrical interconnects layer 108 is electrically connected.

[0041] The electrical interconnects layer 108 may comprise, but not limited to, aluminum, copper, tin, tungsten, zinc, gold, nickel, and aluminum-based alloys containing silicon. The electrical interconnects layer 108 may be a thin film or sheet machined from a large or small thin film or sheet, for example, by cutting, filing, milling and/or drilling the large or small thin film or sheet, and then is glued onto the thermally conductive glue layer 106. In some embodiments, the electrical interconnects layer 108 may be in-situ formed onto the thermally conductive glue layer 106, through depositing corresponding materials by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, physical vapor deposition, chemical vapor deposition, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll-to-roll printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the electrical interconnects layer 108 may be dried, sintered and/or fused.

[0042] The electrical interconnects layer 108 is configured to be flexible and/or deformable, so that the electrical interconnects layer 108 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting. The electrical interconnects layer 108 may be configured to have any suitable thickness, as long as the electrical interconnects layer 108 can accommodate the DC current passing through it, and also remain sufficiently flexible and/or deformable. For example, the electrical interconnects layer 108 may have a thickness from about 0.01 mm to about 2 mm.

[0043] The electrically conductive glue layer 110 is deposited on the electrical interconnects layer 108. The electrically conductive glue layer 110 is preferably thermal conductive. The electrically conductive glue layer 110 is deposited as bonding agent between the n-type semiconductor leg 112 and p-type semiconductor 114 and the electrical interconnects 108. The electrically conductive glue layer 110 is configured to be flexible and/or deformable, so that the electrically conductive glue layer 110 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting.

[0044] The electrically conductive glue layer 110 may comprise, but not limited to, two- component epoxy resin having silver pigments, epoxy resin having copper pigments, epoxy resin having graphene pigments, epoxy resin having nickel pigments, acrylate, epoxy, silicone, graphite, and combinations thereof.

[0045] The electrically conductive glue layer 110 can be formed or deposited on the electrical interconnects layer 108 by roller coating techniques, extrusion techniques, spreading, brushing, and combinations thereof. After depositing, the electrically conductive glue layer 110 may be dried, heated, sintered and/or fused. The electrically conductive glue layer 110 may be configured to have any suitable thickness, as long as electrical current and heat can be transferred or moved effectively and efficiently therethrough and the electrically conductive glue layer 110 can remain sufficiently flexible and/or deformable. For example, the electrically conductive glue layer 110 may have a thickness from about 0.01 mm to about 2 mm.

[0046] The n-type semiconductor leg 112 is electrically connected in series with the p-type semiconductor leg 114 through the electrically conductive glue layer 110, and the electrical interconnects layer 108. For example, one end of the n-type semiconductor leg 112 is electrically connected to one end of the p-type semiconductor leg 114. The n-type semiconductor leg 112 may comprise thermoelectric materials doped with electron donor materials, thus the majority of charge carriers in the thermoelectric materials being negative electrons as schematically depicted by the symbols on the “N” semiconductor leg 112 in FIG. 1A.

[0047] As used herein, thermoelectric materials refer to materials that demonstrate thermoelectric effect. The thermoelectric effect refers to phenomena by which either a temperature difference creates an electric potential or an electric potential creates a temperature difference, which are known more specifically as the Seebeck effect (creating a voltage from temperature difference) and Peltier effect(driving heat flow with an electric current). The thermoelectric materials can be characterized by thermoelectric materials figure of merit zT as

<JS ² T follows: zT = — — , where s is the electrical conductivity of the thermoelectric material, S is the Seebeck coefficient of the thermoelectric material, k is the thermal conductivity of the thermoelectric material, and T is the absolute temperature. Generally speaking, the greater the value of zT, the better the thermoelectric material is, for example, the zT may be greater than 0.2. [0048] The n-type semiconductor leg 112 may be made of n-type thermoelectric materials including, but not limited to, bismuth chalcogenides, lead telluride, polype- ethyl enedioxy thiophene) (PEDOT), polyanilines (PANIs), polythiophenes, polyacetylenes, polypyrrole, and polycarbazole, P-type PEDOT:PSS (polystyrene sulfonate) and PEDOT-Tos (Tosylate), carbon nanotubes, graphene, silicon nanowires, nanocrystalline transition metal silicides, tin selenide, copper, silver, polymer binders, polymer matrix, and combinations thereof. [0049] The n-type semiconductor leg 112 is configured to be flexible and/or deformable, so that the n-type semiconductor leg 112 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting. The n-type semiconductor leg 112 may be configured to have any suitable shapes and dimensions, depending on the cooling and heating requirements, the DC current and voltage requirements and limitations, and the requirement of remaining sufficiently flexible and/or deformable.

[0050] The n-type semiconductor leg 112 can be formed or deposited by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll- to-roll printing, dispenser printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the n-type semiconductor leg 112 may be dried, sintered and/or fused.

[0051] The electrically and thermally insulation leg or layer 113 is disposed between the n-type semiconductor leg 112 and the p-type semiconductor layer 114 to at least electrically isolate the n-type semiconductor leg 112 and the p-type semiconductor layer 114. In some embodiments, the leg or layer 113 may be electrically insulating but thermally conductive, which allows for heat energy flowing therethrough vertically and/or horizontally.

[0052] The leg or layer 113 may be made of materials including, but not limited to, polyvinyl chloride (PVC), glass, asbestos, varnish, resin, paper, Teflon, rubber, porcelain, polyethylene, silicone, composite polymer, epoxy plastic, fiberglass, neoprene, polyurethane, thermoplastics, polyester, polyolefins, polypropylene, polyamide, ethylene propylene rubber (EPR), ethylene propylene diene monomer (EPDM), and combinations thereof.

[0053] The leg or layer 113 can be formed or deposited by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll-to-roll printing, dispenser printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the leg or layer 113 may be dried, sintered and/or fused.

[0054] The leg or layer 113 is configured to be flexible and/or deformable, so that the leg or layer 113 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting. The leg or layer 113 may be configured to have any suitable shapes and dimensions, depending on the shapes and dimensions of the n-type semiconductor leg 112 and the p-type semiconductor leg 114, and the requirement of remaining sufficiently flexible and/or deformable.

[0055] The p-type semiconductor leg 114 is electrically connected in series with the n-type semiconductor leg 112 through the electrically conductive glue layer 110, and the electrical interconnects layer 108. For example, one end of the p-type semiconductor leg 114 is electrically connected to one end of the n-type semiconductor leg 112. The p-type semiconductor leg 114 may comprise thermoelectric materials doped with electron acceptor materials, thus the majority of charge carriers in the thermoelectric materials being positively charged holes as schematically depicted by the symbols “+” on the “P” semiconductor leg 114 in FIG. 1A.

[0056] The p-type semiconductor leg 114 may be made of p-type thermoelectric materials including, but not limited to, bismuth chalcogenides, lead telluride, polype- ethyl enedioxy thiophene) (PEDOT), polyanilines (PANIs), polythiophenes, polyacetylenes, polypyrrole, and polycarbazole, P-type PEDOT:PSS (polystyrene sulfonate) and PEDOT-Tos (Tosylate), carbon nanotubes, graphene, silicon nanowires, nanocrystalline transition metal silicides, tin selenide, copper, silver, polymer binders, polymer matrix, and combinations thereof. [0057] The p-type semiconductor leg 114 is configured to be flexible and/or deformable, so that the p-type semiconductor leg 114 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting. The p-type semiconductor leg 114 may be configured to have any suitable shapes and dimensions, depending on the cooling and heating requirements, the DC current and voltage requirements and limitations, and the requirement of remaining sufficiently flexible and/or deformable.

[0058] The p-type semiconductor leg 114 can be formed or deposited by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll- to-roll printing, dispenser printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the p-type semiconductor leg 114 may be dried, sintered and/or fused.

[0059] The electrically conductive glue layer 116 is deposited on the electrical interconnects layer 118. The electrically conductive glue layer 116 is preferably thermal conductive. The electrically conductive glue layer 116 is deposited as bonding agent between the n-type semiconductor leg 112 and p-type semiconductor 114 and the electrical interconnects 118. The electrically conductive glue layer 116 is configured to be flexible and/or deformable, so that the electrically conductive glue layer 116 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting.

[0060] The electrically conductive glue layer 116 may comprise, but not limited to, two- component epoxy resin having silver pigments, epoxy resin having copper pigments, epoxy resin having graphene pigments, epoxy resin having nickel pigments, acrylate, epoxy, silicone, graphite, and combinations thereof.

[0061] The electrically conductive glue layer 116 can be formed or deposited on the electrical interconnects layer 118 by roller coating techniques, extrusion techniques, spreading, brushing, and combinations thereof. After depositing, the electrically conductive glue layer 116 may be dried, heated, sintered and/or fused. The electrically conductive glue layer 116 may be configured to have any suitable thickness, as long as electrical current and heat can be transferred or moved effectively and efficiently therethrough and the electrically conductive glue layer 116 can remain sufficiently flexible and/or deformable. For example, the electrically conductive glue layer 116 may have a thickness from about 0.01 mm to about 2 mm.

[0062] The electrical interconnects layer 118 is glued to the thermally conductive glue layer 120. The electrical interconnects layer 118 may be formed, shaped, or configured to correspond to the horizontal cross-sections of the n-type and p-type semiconductor legs to which the electrical interconnects layer 118 is electrically connected. That is, the electrical interconnects layer 118 is configured to match the horizontal cross-sections of the n-type and p-type semiconductor legs to which the electrical interconnects layer 118 is electrically connected.

[0063] The electrical interconnects layer 118 may comprise, but not limited to, aluminum, copper, tin, tungsten, zinc, gold, nickel, and aluminum-based alloys containing silicon. The electrical interconnects layer 118 may be a thin film or sheet machined from a large or small thin film or sheet, for example, by cutting, filing, milling and/or drilling the large or small thin film or sheet, and then is glued onto the thermally conductive glue layer 120. In some embodiments, the electrical interconnects layer 118 may be in-situ formed onto the thermally conductive glue layer 120, through depositing corresponding materials by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, physical vapor deposition, chemical vapor deposition, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll-to-roll printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the electrical interconnects layer 118 may be dried, sintered and/or fused.

[0064] The electrical interconnects layer 118 is configured to be flexible and/or deformable, so that the electrical interconnects layer 118 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting. The electrical interconnects layer 118 may be configured to have any suitable thickness, as long as the electrical interconnects layer 118 can accommodate the DC current passing through it, and also remain sufficiently flexible and/or deformable. For example, the electrical interconnects layer 118 may have a thickness from about 0.01 mm to about 2 mm.

[0065] The thermally conductive glue layer 120 is deposited on the electrical insulation layer 122. The thermally conductive glue layer 120 is preferably electrical insulating. The thermally conductive glue layer 120 is deposited as bonding agent between the electrical insulation layer 122 and the electrical interconnects 118. The thermally conductive glue layer 120 is configured to be flexible and/or deformable, so that the thermally conductive glue layer 120 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting. [0066] The thermally conductive glue layer 120 may comprise, but not limited to, thermally conductive epoxy adhesives, epoxy resin-based single- and two-component adhesive having non- metallic fillers, epoxy resin-based adhesive having metallic fillers, silicone thermal plaster viscous adhesive, metal oxides, silica or ceramic microspheres, and combinations thereof.

[0067] The thermally conductive glue layer 120 can be formed or deposited on the electrical insulation layer 122 by roller coating techniques, extrusion techniques, spreading, brushing, and combinations thereof. After depositing, the thermally conductive glue layer 120 may be dried, sintered and/or fused. The thermally conductive glue layer 120 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the thermally conductive glue layer 120 can remain sufficiently flexible and/or deformable. For example, the thermally conductive glue layer 120 may have a thickness from about 0.01 mm to about 2 mm.

[0068] The electrical insulation layer 122 is deposited on the second flexible layer 124. The electrically insulation layer 122 is preferably a thermal conductive layer, such that heat can be effectively and efficiently moved or transferred therethrough. The electrical insulation layer 122 is configured to be flexible and/or deformable, so that the electrical insulation layer 122 would not crack, break, loosen, and/or come off when it is under bending, flexing, stretching, compressing, and/or twisting.

[0069] The electrical insulation layer 122 may comprise electrically insulating and thermally conductive materials including, but not limited to, boron nitride nanosheet (BNNS)/ionic liquid (IL)/polymer composites, boron nitride nanosheet, Alumina, BNNSs polydimethylsiloxane (PDMS) composites, silicon carbide, diamonds, aluminum nitride, thermal conductive and electrical insulating rubber composite, thermal conductive filler and polymer matrix composites, polyethylene (PE), polyvinylchloride (PVC), polypropylene (PP), polyamide (PA), polyester- resin, phenol-resin, silicon-resin, epoxy resins, silicone, ethylene propylene rubber (EPR), ethylene propylene diene monomer (EPDM), and combinations thereof.

[0070] The electrical insulation layer 122 can be formed or deposited on the second flexible layer 124 by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll-to-roll printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. After depositing, the electrical insulation layer 122 may be dried, sintered and/or fused. The electrical insulation layer 122 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the electrical insulation layer 122 can remain sufficiently flexible and/or deformable. For example, the electrical insulation layer 122 may have a thickness from about 0.1 mm to about 10 mm.

[0071] The second flexible layer 124 may comprise a fabric layer, such as a woven and/or stitched fabric layer. In some embodiments, the second flexible layer 124 may comprise a fire resistant layer or sock. In some embodiments, the second flexible layer 124 may comprise a moisture resistant layer. In some embodiments, the second flexible layer 124 may comprise a foam layer, such as polyurethane foam, viscoelastic foam, and latex foam. The second flexible layer 124 is configured to be flexible and/or deformable such that it provides cushioning to a user who rests, sleeps, lies, or sits on the second flexible layer (directly or indirectly). The second flexible layer 124 may further include heat absorption or dissipation layer or materials embedded therein. The heat absorption and/or dissipation materials may include, but not limited to, cooling gels, and phase change material (PCM). The PCM takes advantage of latent heat that can be stored or released from the material over a relatively narrow temperature range. The PCM possesses the ability to change its state with a certain temperature range, for example, a range of about 6 to about 45 degrees Celsius. These materials absorb energy during a heating process as phase change takes place, and release energy to the environment during a reverse cooling process and corresponding phase change. The PCM can convert from solid to liquid state or from liquid to solid state that is suitable for the manufacturing of heat- storage and thermo-regulated textiles and clothing. The second flexible layer 124 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the second flexible layer 124 can remain sufficiently flexible and/or deformable. For example, the second flexible layer 124 may have a thickness from about 0.1 mm to about 20 mm.

[0072] The heat dissipation layer 126 may comprise a fabric layer, such as a woven and/or stitched fabric layer, and is configured to be flexible and/or deformable such that it provides cushioning to a user who rests, sleeps, lies, or sits on the second flexible layer (directly or indirectly). In some embodiments, the heat dissipation layer 126 may comprise a fire resistant layer or sock. In some embodiments, the heat dissipation layer 126 may comprise a moisture resistant layer. In some embodiments, the heat dissipation layer 126 may comprise a foam layer, such as polyurethane foam, viscoelastic foam, and latex foam. The heat dissipation layer 126 may include heat absorption or dissipation materials embedded therein, such as cooling gel or phase change materials as described above. The heat dissipation layer 126 may be configured to have any suitable thickness, as long as heat can be transferred or moved effectively and efficiently therethrough and the heat dissipation layer 126 can remain sufficiently flexible and/or deformable. For example, the heat dissipation layer 126 may have a thickness from about 0.5 mm to about 20 mm.

[0073] In some embodiments, the bedding system 100 may not comprise the heat dissipation layer 126. In some embodiments, a heat dissipation layer substantially similar as the heat dissipation layer 126 may be added to the first flexible layer 102 on the side of the first flexible layer 102 that is distal from the bedding system, for example, by sewing the heat dissipation layer onto the first flexible layer 102.

[0074] In some embodiments, the electrical insulation layers 104 and 122 may comprise a chemical binder or adhesive additive/tape that would allow for adhering the electrical insulation layers 104 and 122 directly to the electrical interconnects layers 108 and 118, respectively. In such embodiments, the glue layers 106 and 120 may not be required.

[0075] In this disclosure, the electrical interconnects layer 108, the electrically conductive glue layer 110, the n-type semiconductor leg 112, the p-type semiconductor layer 114, the electrically conductive glue layer 116, and the electrical interconnects layer 118 may be referred to as a TECH or Peltier element collectively. In some embodiment, the TECH element may further include the electrically and/or thermally insulation leg or layer 113.

[0076] In some embodiments, the electrical insulation layer 122 and the second flexible layer 124 may be integrated or combined as one single electrical insulation flexible layer, film, or sheet. The first flexible layer 102 and the electrical insulation layer 104 may be integrated or combined as one single electrical insulation flexible layer, film or sheet.

[0077] In some embodiments, the electrically and/or thermally insulation leg 113, the electrical insulation layer 122, and the second flexible layer 124 can be integral as a single integral structure. For example, a single electrical insulation flexible sheet having a thickness same as the height of the leg 113 can be machined (e.g., cutting and milling) to remove the excess materials to form the integral structure including the leg 113, the electrical insulation layer 122, and the second flexible layer 124, and the TECH element can then be assembled onto the formed integral structure with the leg 113 separating the n-type semiconductor leg 112 and the p-type semiconductor layer 114. In such embodiments, the portion of the thermally conductive glue layer 120 that is in contact with the leg 113 may be not required. In this example, the height of the leg 113 is defined as the dimension in the direction from the second flexible layer 124 to the first flexible layer 102.

[0078] To function the bedding system 100, the DC power source or supply 128 may be provided for supplying a DC electrical current and voltage across the TECH element. In some embodiments, a control box or device may be provided or incorporated into the bedding system 100, which may provide the DC electrical current and voltage across the TECH element.

[0079] As shown in FIG. 1 A, a positive DC voltage is provided across the n-type semiconductor leg 112 to the p-type semiconductor layer 114. The electrons as the majority of the charge carriers in the n-type semiconductor leg 112 would be attracted toward the positive pole, while the holes as the majority of the charge carriers in the p-type semiconductor leg 114 would move toward the negative pole, as shown by the arrows in the n-type semiconductor leg 112 and the p- type semiconductor layer 114. As result, according to Peltier effect, the electrical interconnects layer 108 would be cooled and the electrical interconnects layer 118 would be hot. That is, heat energy is transferred from the electrical interconnects layer 108 to the electrical interconnects layer 118. Accordingly, heat load from the first flexible layer 102 would be pumped by the TECH element from the electrical interconnects layer 108 to the electrical interconnects layer 118, thereby cooling the first flexible layer 102. If a user touches the first flexible layer 102, the user would be cooled consequently. Meanwhile, the second flexible layer 124 would be heated by the heat pumped to the electrical interconnects layer 118. The heat may then be dissipated into the surrounding area of the second flexible layer 124, through heat radiation, heat conduction, and natural and/or forced heat convention. In this example, the heat may also be dissipated through the heat dissipation layer 126. As described above, the cooling gel or PCM incorporated in the heat dissipation layer 126 can dissipate the heat. As such, the heat can be pumped continuously from the first flexible layer 102 to the second flexible layer 124.

[0080] Similarly, if the second flexible layer 124 is desired to be cooled, the DC current and voltage applied across the TECH element can be reversed. By reversing the DC current, heat load from the second flexible layer 124 would be pumped by the TECH element from the second flexible layer 124 to the first flexible layer 102, thereby cooling the second flexible layer 124 while heating the first flexible layer 102. Also, similarly, the heat pumped to the first flexible layer 102 can be dissipated as described above with respect to the second flexible layer 124. As such, the heat can be pumped continuously from the second flexible layer 124 to the first flexible layer 102.

[0081] The heat flow rate (Watts) or heat flux (Watts/m ² ) pumped by the TECH element can be regulated or controlled by varying the amount of applied voltage. For example, the amplitude and/or the duration of the applied voltage can be varied. By designing various voltage waveforms and programming such voltage waveforms into the control box, the cooling rate and/or the heating rate can be automatically regulated. Consequently, by cooling and heating through the TECH element, a desired temperature can be achieved and maintained, which can significantly improve the comfort level of a user of the bedding system 100.

[0082] FIG. IB depicts a perspective view of the example bedding system 100 in FIG. 1 A, in according to one embodiment of the present disclosure. For simplicity and clarity, the DC power source 128 or the control box is not illustrated in FIG. IB. Further, the first flexible layer 102, the electrical insulation layer 104, and the thermally conductive glue layer 106 are schematically illustrated as one layer. Similarly, the thermally conductive glue layer 120, the electrical insulation layer 122, the second flexible layer 124, and the heat dissipation layer 126 are schematically illustrated as one layer.

[0083] As shown in FIG. IB, the n-type semiconductor leg 112 and the p-type semiconductor layer 114 each define a width W, a height H, and a length L. Although the n-type semiconductor leg 112 can differ from the p-type semiconductor layer 114 in shape and dimensions, the n-type semiconductor leg 112 and the p-type semiconductor layer 114 are substantially the same in shape and dimensions in this example embodiment. The shapes and dimensions of the n-type semiconductor leg 112 and the p-type semiconductor layer 114 may be devised, modeled and/or optimized through computational simulation. For example, given the heat flux load, the desired temperature difference between the cold side and the hot side of the TECH element, and the DC current, the cross-section area and the height of the n-type semiconductor leg 112 and the p-type semiconductor layer 114 may be calculated using the follow equation: Where: q' is the heat flux into the cooling side of the TECH element, 0 is the semiconductor leg packing density, / is the DC current, T _c is the cooling side temperature of the TECH element, ^a _p,n = U _p — cc _n is th ^e Seebeck coefficient difference of the p-type semiconductor leg and n-type semiconductor leg, A is the cross-area of the semiconductor leg, H is the height of the semiconductor leg, k is the thermal conductivity of the semiconductor leg, T _h is the temperature of the heating side of the TECH element, and p is the electrical conductivity of the semiconductor leg. Given the cross-section area and the height of the n-type semiconductor leg 112 and the p-type semiconductor layer 114, and the heat flux, the DC current may also be determined using the above equation.

[0084] In some embodiments, the first flexible layer 102 and the second flexible layer 124 or the heat dissipation layer 126 may be configured to have a greater size than the TECH element, such that the first flexible layer 102 and the second flexible layer 124 or the heat dissipation layer 126 can be sewn together along the edges, thereby enclosing, securing and protecting the TECH element from surrounding environment.

[0085] FIG. 2 depicts a side view of an example bedding system 200 having more than one localized climate regulation elements based on Peltier effect, in according to one embodiment of the present disclosure. As shown in FIG. 2, three TECH elements are incorporated in the bedding system 200. However, more than three TECH elements can be incorporated in a bedding system. The components in the bedding system 200 are substantially same as or similar to the components in the bedding system 100, therefore for brevity, details of the components in the bedding system 200 may be omitted.

[0086] As illustrated in FIG. 2, the TECH element in the bedding system 200 may comprise an electrical interconnects layer 208, an electrically conductive glue layer 210, a n-type semiconductor leg 212, a p-type semiconductor layer 214, an electrically and/or thermally insulation leg or layer 213 disposed between the n-type semiconductor leg 212 and the p-type semiconductor layer 214, an electrically conductive glue layer 216, and an electrical interconnects layer 218. The three TECH elements are electrically connected in series through the electrical interconnects layers 208 and 218 while thermally connected in parallel. In some embodiments, the three TECH elements may be electrically connected in parallel while thermally connected in parallel as well. [0087] Similar to the bedding system 100, the bedding system 200 may further comprise a first flexible layer 202, an electrical insulation layer 204 deposited on the first flexible layer 202, a thermally conductive glue layer 206 deposited on the electrical insulation layer 204, a thermally conductive glue layer 220, an electrical insulation layer 222, a second flexible layer 224, a heat dissipation layer 226, and an DC electric power source 228.

[0088] FIG. 3 depicts a perspective view of an example bedding system 300 having zoned localized climate regulation elements based on Peltier effect, in according to one embodiment of the present disclosure. As shown in FIG. 3, the bedding system 300 may comprise a first flexible layer 302 and an opposing second flexible layer 304 (dot lined for clarity), each of which defines a length L and a width W. The first flexible layer 302 in the bedding system 300 is schematically illustrated for simplicity, however, may further comprise a thermally conductive glue layer, an electrical insulation layer, a fabric layer, a fire resistant layer, a moisture resistant layer, and/or a heat dissipation layer, as described in the bedding systems 100 and 200. The opposing second flexible layer 304 in the bedding system 300 is also schematically illustrated for simplicity, however, may further comprise a thermally conductive glue layer, an electrical insulation layer, a fabric layer, a fire resistant layer, a moisture resistant layer, and/or a heat dissipation layer, as described in the bedding systems 100 and 200.

[0089] The first flexible layer 302 and the opposing second flexible layer 304 may be divided into multiple cooling and heating zones, such as six cooling and heating zones in this example embodiment. Each of the multiple cooling and heating zones can contain any desired number of the TECH element. In this example embodiments, each of the six cooling and heating zones is configured to have two TECH elements 306 disposed between the first flexible layer 302 and the opposing second flexible layer 304. The TECH elements 306 in the bedding system 300 are substantially same as the TECH elements in the bedding systems 100 and 200. Details of the TECH elements 306 are therefore omitted herein for brevity.

[0090] The TECH elements 306 in each zone may be electrically connected in series and thermally in parallel. In some embodiments, the TECH elements 306 in each zone may be electrically connected in parallel and thermally in parallel as well. The multiple zones may be electrically connected in series and thermally in parallel, as indicated by the arrows 310. In some embodiments, the multiple zones may be electrically connected in parallel and thermally in parallel. The horizontal orientation of the TECH elements 306 in each zone may be arranged to be any orientation with respect to the length L direction or the width W direction of the first flexible layer 302 and the opposing second flexible layer 304.

[0091] The bedding system 300 may be provided or incorporated a control box 308. The control box 308 is configured to provide a DC current and voltage to the TECH elements 306. The control box 308 may further be configured to supply a power to other components of the bedding system 300. The control box 308 is programmed to control and regulate the TECH elements 306 and other components of the bedding system 300 based on, for example, pre-designed voltage or current waveforms stored therein, when a command signal is received. The control box 308 may include one or more network communication interfaces or modules, such as Bluetooth module, WIFI module, Zigbee module, infrared communication module, and/or near field communication module, such that the control box 308 is capable of performing data communications with external or internal devices. For example, the control box 308 may communicate, via the one or more network communication interfaces or modules, with a remote control (e.g., a smart phone, a computing tablet or a smart watch) to receive the command signal from a user for controlling the bedding system 300.

[0092] Each of the multiple zones may be independently controlled by the control box 308. For example, the bedding system 300 may be a mattress. The zones in the length L direction may be referred to as a head zone, a torso and butt zone, and a leg and foot zone, respectively. The zones may also be divided into two groups in the width W direction, one group for each user comprising a head zone, a torso and butt zone, and a leg and foot zone. Each user may prefer different temperatures for the zones. For example, a first user may prefer a warm head zone, a cool torso and butt zone, and a hot leg and foot zone. A second user may desire a hot head zone, a warm torso and butt zone, and a cool leg and foot zone. The control box 308 is programmed to regulate the TECH elements in each of the multiple zones according to the temperature demands of the users.

[0093] The bedding system 300 may further comprise one or more temperature sensors 312.

The temperature sensors 312 may be disposed in any position of the bedding system 300 where temperatures are desired to be measured, monitored, and/or regulated. For example, the temperature sensors 312 may be disposed on the TECH elements 306, the first flexible layer 304, and/or the second flexible layer 304. The temperature sensors 312 can any suitable temperature sensors. For example, the temperature sensors 312 may be printed sensors that are printed onto the bedding system 300 directly or indirectly, using any suitable printing techniques such as 3D printing, inkjet printing, screening printing, dispenser printing, aerosol printing, and roll-to-roll printing. The temperature sensors 312 are in data communication with the control box 308 to provide temperature signals to the control box 308. The control box 308 can regulate the TECH elements based on the temperature signals.

[0094] The space among the zones other than the TECH elements may be filled with flexible and/or deformable materials. The flexible and/or deformable materials are electrically insulating materials. The flexible and/or deformable materials may also be thermally insulating materials or thermally conductive materials, or combination thereof. The flexible and/or deformable materials can electrically separate, insulate or isolate the TECH elements in one zone from the TECH elements in other zones, and can also provide structural support and cushioning function to the bedding system 300. The flexible and/or deformable materials may include, but not limited to, fabric, polymers, foams, fire resistant materials, moisture resistant materials, and combinations thereof.

[0095] FIG. 4 depicts a flow chart of an example method 400 of manufacturing a bedding system having localized climate regulation elements based on Peltier effect, in according to one embodiment of the present disclosure. The steps of the method 400 may be performed in any order. One or more steps may be omitted, added, combined, and/or modified. The method 400 may include the following steps.

[0096] In step 410, a first flexible layer and a second flexible layer are provided. For example, the first flexible layer and the second flexible layer herein are substantially same as or similar to the first and second flexible layers, respectively in the bedding systems 100, 200, and/or 300. [0097] In step 420, an electrical insulating layer is deposited on each of the first and second flexible layers. The electrical insulating layer herein are substantially same as or similar to the electrical insulating layers in the bedding systems 100, 200, and/or 300.

[0098] In step 430, electrical interconnects layers are formed on the electrical insulating layers on the first and second flexible layers. The electrical interconnects layers herein are substantially same as or similar to the electrical interconnects layers in the bedding systems 100, 200, and/or 300.

[0099] In step 440, n-type and p-type semiconductor legs and electrical insulation layers between the n-type and p-type semiconductor legs are formed on the first flexible layers. One end of n-type semiconductor legs are electrically connected to one end of p-type semiconductor legs through the electrical interconnects layers. The n-type and p-type semiconductor legs and electrical insulation layers herein are substantially same as or similar to the n-type and p-type semiconductor legs and electrical insulation layers, respectively, in the bedding systems 100,

200, and/or 300.

[0100] In step 450, the second flexible layer is laminated onto the first flexible layer. The electrical interconnects layers on the second flexible layer are aligned with the other end of the n- type and p-type semiconductor legs, thereby ensuring the electrical interconnects layers on the second flexible layer to be in electrical contact with the other end of the n-type and p-type semiconductor legs. As such, TECH elements are formed between the first flexible layer and the second flexible layer.

[0101] In some embodiments, the method 400 may further include depositing a thermally conductive glue layer on the electrical insulation layer of the first flexible layer and the second flexible layer. The thermally conductive glue layer can facilitate adherence of the electrical interconnects layer to the electrical insulation layer of the first flexible layer and the second flexible layer. The electrical interconnects are thermally in contact with the electrical insulation layer through the thermally conductive glue layer.

[0102] In some embodiments, the method 400 may further including forming an electrically conductive glue layer on the electrical interconnects layer of the first flexible layer and the second flexible layer that is electrically in contact with the n-type and p-type semiconductor legs. The electrically conductive glue layer can facilitate adherence of the electrical interconnects layer to the n-type and p-type semiconductor legs. The electrical interconnects are electrically in contact with the n-type and p-type semiconductor legs through the electrically conductive glue layer.

[0103] In some embodiments, the method 400 may further include incorporating at least one temperature sensor into the bedding system. The at least one temperature sensor can be incorporated into any suitable position of the bedding system where regulating temperature is desired.

[0104] In some embodiments, the method 400 may further include incorporating a control box into the bedding system. As described above, the control box can provide electrical power to the bedding system, regulate the TECH elements, communicate with the temperature sensors, and communicate with a remote control device.

[0105] In some embodiments, the method 400 may further include providing a third flexible layer including a phase change material (PCM). The third flexible layer may be laminated onto at least one of the first and second flexible layer.

[0106] As described above, in the method 400, the electrical insulation layer, the thermally conductive glue layer, the electrical interconnects layer, the electrically conductive glue layer, the n-type semiconductor leg, the p-type semiconductor layer, and the electrically insulating layer between the n-type semiconductor leg and the p-type semiconductor layer, can be formed or manufactured by printing techniques, roller coating techniques, spin coating techniques, molding techniques, extrusion techniques, and combinations thereof. The printing techniques may include inkjet printing, screen sprinting, roll-to-roll printing, dispenser printing, extrusion printing, three dimensional (3D) printing, aerosol printing, stereolithography, selective laser sintering, fused deposition modeling, offset lithography, and flexography. Further, the electrical insulation layer, the thermally conductive glue layer, the electrical interconnects layer, the electrically conductive glue layer, the n-type semiconductor leg, the p-type semiconductor layer, and the electrically insulating layer between the n-type semiconductor leg and the p-type semiconductor layer, may be dried, sintered and/or fused.

[0107] FIG. 5 depicts a schematic diagram of an example control box or device 500 configured to control a bedding system, according to one embodiment of the present disclosure. The control box 500 is configured to control the bedding systems disclosed herein. The control box 500 may include a processor 510, a memory 520, an application 530, a display 540, and an input interface 550.

[0108] The processor 510 may include processing circuitry, additional microprocessors, memories, data encoders, command encoders, security primitives and tamper-proofing hardware that are necessary to control the bedding systems.

[0109] The memory 520 may be coupled to the processor 510. The memory 510 may be a read only memory, a read/write memory, or a write-once read-multiple memory. The memory 510 may be configured to store the application 530 and other data. [0110] The application 530 may comprise one or more software applications comprising instructions for execution by the processor 510. When executed by the processor 510, the application 530 can provide the function for controlling the bedding systems.

[0111] The display 540 may be any type of display for presenting visual information such as a flat panel display, a liquid crystal display, or a light-emitting diode display. The display 540 may be configured to display temperature of the bedding systems, and the voltage or current waveforms used for regulating the TECH elements.

[0112] The input interface 550 may include any interface or device for entering information into the control box, such as a touch screen, a cursor-control device, a microphone, and a digital camera. The input interface 550 may be configured to enter information and interact with the application 530.

[0113] The control box 500 may further comprise various network communication interfaces or modules, such as WIFI module, Bluetooth module, infrared module, and near field communication module, for communication with external devices (e.g., smart phones and smart watches).

[0114] An example method of using the control box 500 for regulating localized or microclimate environment for a user of the bedding systems disclosed here, may comprise: providing the bedding system to the user; providing a remote control to the user, the remote control configured to run applications and be in data communication with the control box 500; selecting a desired temperature and/or a desired TECH element zone by the user on the remote control; receiving by the control box 500 a temperature detected by the at least one temperature sensor of the bedding system, the detected temperature being a temperature of the portion of the bedding system the user desires; transmitting by the remote control a communication signal corresponding to the desired temperature to the control box 500; comparing by the control box 500 the desired temperature and the detected temperature; in determination that the detected temperature is greater than the desired temperature, supplying by the control box 500 a first DC electrical current to the TECH element(s) of the bedding system, such that the side or end of the TECH element(s) proximal to the user is being controllably cooled to the desired temperature; and in determination that the detected temperature is less than the desired temperature, supplying by the control box a second DC electrical current to the TECH element(s) of the bedding system, such that the side or end of the TECH element(s) proximal to the user is being controllably heated to the desired temperature.

[0115] The direction of the first DC electrical current opposes the direction of the second DC electrical current. The control box 500 is programmed to control the TECH elements in response to a command signal transmitted from the remote control. The remote control is in data communication with the control box 500 through at least one of a WIFI network communication, a wired network communication, a Bluetooth communication, a Zigbee communication, a near field communication, and an infrared communication. The remote control may be a smart phone, a tablet computer, a laptop computer, and a smart watch.

[0116] FIG. 6 depicts a perspective view of an example bedding system 600, in according to one embodiment of the present disclosure. As shown in FIG. 6, the bedding system 600 may comprise a bed frame or base 610, a mattress or mattress base 620 supported on the bed frame 610, and a plurality of TECH elements 630 arranged in strips, grids, zones and/or segments on the mattress or mattress base 620. The TECH elements 630 may be electrically connected in series and thermally in parallel. In some embodiments, the TECH elements 630 may be electrically connected in parallel and thermally in parallel as well. The strips, grids, zones and/or segments may be controlled independently for desired temperature or comfort level through a control box (not shown in FIG. 6).

[0117] FIG. 7 depicts a perspective view of an example bedding system 700, in according to one embodiment of the present disclosure. As shown in FIG. 7, the bedding system 700 may comprise a bed frame or base 710, a mattress or mattress base 720 supported on the bed frame 710, and a plurality of TECH elements 730 and 740 arranged in strips, grids, zones and/or segments on the mattress or mattress base 720. The TECH elements 730 may be electrically connected in series and thermally in parallel. In some embodiments, the TECH elements 730 may be electrically connected in parallel and thermally in parallel as well. The TECH elements 740 may be electrically connected in series and thermally in parallel. In some embodiments, the TECH elements 740 may be electrically connected in parallel and thermally in parallel as well. The strips, grids, zones and/or segments may be controlled independently for desired temperature or comfort level through a control box (not shown in FIG. 7).

[0118] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”),

“contain” (and any form contain, such as “contains” and “containing”), and any other grammatical variant thereof, are open-ended linking verbs. As a result, a method or article that “comprises”, “has”, “includes” or “contains” one or more steps or elements possesses those one or more steps or elements, but is not limited to possessing only those one or more steps or elements. Likewise, a step of a method or an element of an article that “comprises”, “has”, “includes” or “contains” one or more features possesses those one or more features, but is not limited to possessing only those one or more features.

[0119] As used herein, the terms “comprising,” "has," “including,” "containing," and other grammatical variants thereof encompass the terms “consisting of’ and “consisting essentially of.”

[0120] The phrase “consisting essentially of’ or grammatical variants thereof when used herein are to be taken as specifying the stated features, integers, steps or components but do not preclude the addition of one or more additional features, integers, steps, components or groups thereof but only if the additional features, integers, steps, components or groups thereof do not materially alter the basic and novel characteristics of the claimed compositions or methods.

[0121] All publications cited in this specification are herein incorporated by reference as if each individual publication were specifically and individually indicated to be incorporated by reference herein as though fully set forth.

[0122] Subject matter incorporated by reference is not considered to be an alternative to any claim limitations, unless otherwise explicitly indicated.

[0123] Where one or more ranges are referred to throughout this specification, each range is intended to be a shorthand format for presenting information, where the range is understood to encompass each discrete point within the range as if the same were fully set forth herein.

[0124] While several aspects and embodiments of the present invention have been described and depicted herein, alternative aspects and embodiments may be affected by those skilled in the art to accomplish the same objectives. Accordingly, this disclosure and the appended claims are intended to cover all such further and alternative aspects and embodiments as fall within the true spirit and scope of the invention.