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Patent Searching and Data


Title:
BEND-RESISTANT WIRE
Document Type and Number:
WIPO Patent Application WO/2018/120347
Kind Code:
A1
Abstract:
Provided is a bend-resistant wire comprising a copper wire (1). The copper wire (1) comprises an ultra-high molecular weight polyethylene fiber wire (11) and a tinsel wire layer (12) wound on the surface of the ultra-high molecular weight polyethylene fiber wire (11). A copper wire layer (13) is further wound on the surface of the tinsel wire layer (12). The ultra-high molecular weight polyethylene fiber wire (11) features optimal softness and desirable anti-impact performance, is superior to aramid fiber, has a strength about 40% higher than Kevlar and two times higher than carbon fiber, and provides good bending fatigue performance; in addition, an impact load value of the ultra-high molecular weight polyethylene fiber wire (11) can be ten times that of steel and more than twice that of glass fiber and aramid fiber. The degree of bending resistance of the copper wire (1) filled with the ultra-high molecular weight polyethylene fiber wire (11) is greatly improved. A tinsel wire is wound on the outside of the ultra-high molecular weight polyethylene fiber wire (11), such that the ultra-high molecular weight polyethylene fiber wire (11) may not easily break when bent by external force, greatly extending a service life of the wire.

Inventors:
WEI LEN (CN)
ZHANG TOM (CN)
Application Number:
CN2017/072395
Publication Date:
July 05, 2018
Filing Date:
January 24, 2017
Export Citation:
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Assignee:
SHENZHEN LEADERMENT TECH CO LTD (518000, CN)
International Classes:
H01B7/18; H01B7/04
Foreign References:
CN205388913U2016-07-20
CN204010722U2014-12-10
CN202677921U2013-01-16
JP2001067948A2001-03-16
Attorney, Agent or Firm:
SHENZHEN TALENT PATENT SERVICE (518000, CN)
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