Title:
BENDING PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/140222
Kind Code:
A1
Abstract:
This bending processing device is provided with a robot, a chuck mechanism, and multiple bending mechanisms. The multiple bending mechanisms are provided as separate bodies from the robot and the chuck mechanism, and are arranged within a space which can be reached by a workpiece held by the chuck mechanism.
Inventors:
YOGO TERUAKI (JP)
OZEKI SADAYOSHI (JP)
OZEKI SADAYOSHI (JP)
Application Number:
PCT/JP2016/056260
Publication Date:
September 09, 2016
Filing Date:
March 01, 2016
Export Citation:
Assignee:
OPTON KK (JP)
International Classes:
B21D7/024
Foreign References:
| JP2008036676A | 2008-02-21 | |||
| JPH0565440U | 1993-08-31 | |||
| JP2012228714A | 2012-11-22 |
Other References:
See also references of EP 3266529A4
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
Nagoya international patent business corporation (JP)
Nagoya international patent business corporation (JP)
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