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Patent Searching and Data


Title:
BENDING SYSTEM AND DIE TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2020/230730
Kind Code:
A1
Abstract:
A first die holding member (78) of a first die exchanging unit (70) holds a first die (12), which is to be exchanged, in a state of being locked in a locking hole (12h) of the first die (12). A second die holding member (78) of a second die exchanging unit (70) holds a second die (12'), which is not to be exchanged, in a state of being locked in a locking hole (12h') of the second die (12'). Then, the first die exchanging unit (70) moves in a left-right direction, with movement of the second die exchanging unit (70) in the left-right direction stopped.

Inventors:
SATO MASAAKI (JP)
YAMAGUCHI YOHEI (JP)
Application Number:
PCT/JP2020/018708
Publication Date:
November 19, 2020
Filing Date:
May 08, 2020
Export Citation:
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Assignee:
AMADA CO LTD (JP)
International Classes:
B21D5/02; B21D37/04
Foreign References:
JP2000071028A2000-03-07
JP2006000855A2006-01-05
JPH1110235A1999-01-19
JP4672868B22011-04-20
JPS5841800B21983-09-14
JPS5947861B21984-11-21
JP2019092890A2019-06-20
Other References:
See also references of EP 3970874A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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