Title:
BENDING SYSTEM AND DIE TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2020/230730
Kind Code:
A1
Abstract:
A first die holding member (78) of a first die exchanging unit (70) holds a first die (12), which is to be exchanged, in a state of being locked in a locking hole (12h) of the first die (12). A second die holding member (78) of a second die exchanging unit (70) holds a second die (12'), which is not to be exchanged, in a state of being locked in a locking hole (12h') of the second die (12'). Then, the first die exchanging unit (70) moves in a left-right direction, with movement of the second die exchanging unit (70) in the left-right direction stopped.
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WO/2014/153586 | BENDING TOOLS FOR PRE-BENDING AND HEMMING |
JPS60213315 | DIE EXCHANGING DEVICE |
JPS5818620 | 【考案の名称】プレスブレ-キ装置 |
Inventors:
SATO MASAAKI (JP)
YAMAGUCHI YOHEI (JP)
YAMAGUCHI YOHEI (JP)
Application Number:
PCT/JP2020/018708
Publication Date:
November 19, 2020
Filing Date:
May 08, 2020
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B21D5/02; B21D37/04
Foreign References:
JP2000071028A | 2000-03-07 | |||
JP2006000855A | 2006-01-05 | |||
JPH1110235A | 1999-01-19 | |||
JP4672868B2 | 2011-04-20 | |||
JPS5841800B2 | 1983-09-14 | |||
JPS5947861B2 | 1984-11-21 | |||
JP2019092890A | 2019-06-20 |
Other References:
See also references of EP 3970874A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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