Title:
BENDING A TAB FLEX CIRCUIT VIA CANTILEVERED LEADS
Document Type and Number:
WIPO Patent Application WO2003036763
Kind Code:
A3
Abstract:
A method of manufacturing an electronic device is provided comprising the steps of providing a circuit having at least one cantilever lead (310), providing a die having at least one bonding region (330), bonding the at least one cantilever lead to the at least one bonding region (330), and bending the at least one bonded cantilever lead (355). Preferably, the electronic device comprises an inkjet cartridge.
Inventors:
CHOY SI-LAM
Application Number:
PCT/US2002/034092
Publication Date:
October 16, 2003
Filing Date:
October 24, 2002
Export Citation:
Assignee:
HEWLETT PACKARD CO (US)
International Classes:
B41J2/16; B41J2/175; H05K3/36; H05K1/00; (IPC1-7): H01R12/08
Foreign References:
| EP0562308A2 | 1993-09-29 | |||
| US5831788A | 1998-11-03 | |||
| US5742484A | 1998-04-21 |
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