Title:
Bi-Al-Zn-BASED Pb-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2011/158668
Kind Code:
A1
Abstract:
Disclosed is a Pb-free solder alloy with low residual stress at solidification and high bonding strength and reliability, that can suppress Ni-Bi reaction and Ni diffusion when an electronic component that includes Ni and a substrate are bonded, and that can withstand high reflow temperatures. A first Pb-free solder alloy contains 0.03% to 0.70% by mass Al and 0.2% to 14.0% by mass Zn, and the balance, excluding unavoidable impurities, is formed from Bi. A second Pb-free solder alloy contains 0.03% to 0.70% by mass Al and 0.2% to 14.0% by mass Zn, does not contain more than 0.500% by mass P, and the balance, excluding unavoidable impurities, is formed from Bi.
Inventors:
ISEKI Takashi (Advanced Materials Div. Sumitomo Metal Mining Co., LTD. 6-1, Suehiro-cho 1-chom, Ome-shi Tokyo 01, 〒1988601, JP)
Application Number:
JP2011/062792
Publication Date:
December 22, 2011
Filing Date:
June 03, 2011
Export Citation:
Assignee:
SUMITOMO METAL MINING CO., LTD. (11-3, Shimbashi 5-chome Minato-ku Tokyo, 16, 〒1058716, JP)
住友金属鉱山株式会社 (〒16 東京都港区新橋５丁目１１番３号 Tokyo, 〒1058716, JP)
住友金属鉱山株式会社 (〒16 東京都港区新橋５丁目１１番３号 Tokyo, 〒1058716, JP)
International Classes:
B23K35/26; C22C12/00
Attorney, Agent or Firm:
TSUJIKAWA Michinori (Taishodo Bldg, 6F 14-16, Shiba 5-chom, Minato-ku Tokyo 14, 〒1080014, JP)
Download PDF:
Claims:
Previous Patent: METHOD FOR DETECTION OF COLORECTAL TUMOR
Next Patent: LANCET AND PUNCTURE DEVICE USING SAME
Next Patent: LANCET AND PUNCTURE DEVICE USING SAME