Title:
Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2012/002173
Kind Code:
A1
Abstract:
A high-temperature solder alloy comprising a Bi-Sn-based solder alloy containing 90 mass% or more of Bi, wherein the Bi-Sn-based solder alloy additionally contains 1 to 5 mass% of Sn and 0.5 to 5 mass% of at least one element selected from Sb and/or Ag, and more preferably additionally contains 0.0004 to 0.01 mass% of P.
Inventors:
UESHIMA Minoru (23, Senju-hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
上島 稔 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
INAGAWA Yoshimi (23, Senju-hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
上島 稔 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
INAGAWA Yoshimi (23, Senju-hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
Application Number:
JP2011/063894
Publication Date:
January 05, 2012
Filing Date:
June 17, 2011
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO., LTD. (23 Senju-hashido-cho, Adachi-ku Tokyo, 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
UESHIMA Minoru (23, Senju-hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
上島 稔 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
UESHIMA Minoru (23, Senju-hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
上島 稔 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
International Classes:
B23K35/26; B23K1/00; C22C12/00; H05K3/34; B23K101/40
Attorney, Agent or Firm:
HIROSE Shoichi (Tozan Building, 4-2 Nihonbashi Honcho 4-chome, Chuo-k, Tokyo 23, 〒1030023, JP)
Claims:
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