Title:
BIAS APPLICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/259368
Kind Code:
A1
Abstract:
A bias application device (2) is used for a sputtering device (1) including a deposition chamber (11) in which a substrate (S) moves to a first region (FR) where at least a predetermined process is performed and to a second region (SR) other than the first region. The bias application device applies a bias from a power supply (3) to the substrate and includes a first electrode (21) that is connected to the power supply (3) and fixed to the first region (FR).
Inventors:
NAGAE EKISHU (JP)
AOYAMA TAKAAKI (JP)
ISHIDA MASATAKA (JP)
OGO YOSHINORI (JP)
AOYAMA TAKAAKI (JP)
ISHIDA MASATAKA (JP)
OGO YOSHINORI (JP)
Application Number:
PCT/JP2021/021763
Publication Date:
December 15, 2022
Filing Date:
June 08, 2021
Export Citation:
Assignee:
SHINCRON CO LTD (JP)
International Classes:
H01L21/203; H01L21/316
Domestic Patent References:
| WO2016203585A1 | 2016-12-22 | |||
| WO2009154196A1 | 2009-12-23 |
Foreign References:
| JP2014135464A | 2014-07-24 | |||
| JPH07216547A | 1995-08-15 | |||
| JPH03215666A | 1991-09-20 | |||
| JP2006283132A | 2006-10-19 | |||
| JP2012136758A | 2012-07-19 | |||
| JP2000239848A | 2000-09-05 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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