Title:
BIAXIALLY ORIENTED MULTILAYER FILM
Document Type and Number:
WIPO Patent Application WO/2013/121833
Kind Code:
A1
Abstract:
[Problem] To provide a mold release film for semiconductor package molding or LED lens molding, namely to provide a biaxially oriented multilayer film which has excellent heat resistance, flexibility and mold releasability.
[Solution] A biaxially oriented multilayer film which is obtained by laminating surface layer parts (layers A) that are formed of a polyarylene sulfide resin on both surfaces of a base layer part (layer B) that is mainly composed of a polyester resin. This biaxially oriented multilayer film is characterized in that an orientation parameter (fn) as calculated by the refractive index (nMD) of the layer B in one film in-plane direction, the refractive index (nTD) of the layer B in another film in-plane direction that is perpendicular to the one film in-plane direction and the refractive index (nZD) of the layer B in the film thickness direction is 0.150 or less.
Inventors:
MACHIDA TETSUYA (JP)
YOSHIDA SHOHEI (JP)
HIGASHIOJI TAKUJI (JP)
YOSHIDA SHOHEI (JP)
HIGASHIOJI TAKUJI (JP)
Application Number:
PCT/JP2013/051067
Publication Date:
August 22, 2013
Filing Date:
January 21, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/00; B29C33/68; B29C55/14; B32B27/36; B29K67/00; B29K81/00; B29L7/00; B29L9/00
Foreign References:
JP2011089110A | 2011-05-06 | |||
JP2010234804A | 2010-10-21 | |||
JPH1086306A | 1998-04-07 | |||
JPS62255142A | 1987-11-06 | |||
JP2011084036A | 2011-04-28 |
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