BIDIRECTIONAL CONDUCTIVE MODULE

WIPO Patent Application WO/2020/022534

A1

The present invention relates to a bidirectional conductive module for electrically connecting an upper device and a lower device, the bidirectional conductive module comprising: an insulating body formed of an insulating material and having a plurality of through holes penetrated in the vertical direction; a plurality of conductive pattern portions formed in the respective through holes so as to electrically connect the upper device and the lower device by forming signal lines in the vertical direction; elastic springs made of a conductive material and formed inside the insulating body so as to surround the periphery of each of the through holes, thereby providing a restoring force in the vertical direction; and ground terminal portions in contact with the elastic springs and coupled to the bottom of the insulating body such that the plurality of conductive pattern portions are exposed to the bottom, thereby grounding the elastic springs. Accordingly, the bidirectional conductive module can replace a pogo-pin type semiconductor test socket while enabling stable signal transmission and a high-speed test, and can be applied to an interposer that electrically connects a high-speed CPU and a board between the CPU and the board.

JP4098676	How to manufacture a wiring test mount and a mount for it
JP4413373	Probe unit for four-terminal measurement
JPH09178775	PROBE CARD FOR PROBING TEST DEVICE

MOON HAEJOONG (KR)
LEE EUNJOU (KR)
JUNG JUYEON (KR)

PCT/KR2018/008473

January 30, 2020

July 26, 2018

Click for automatic bibliography generation  

INNO GLOBAL INC (KR)

G01R1/073; G01R1/04; G01R1/067; G01R31/28

KR101482245B1	2015-01-16
KR20130127108A	2013-11-22
KR101059961B1	2011-08-30
KR20100022211A	2010-03-02
KR20110018903A	2011-02-24

NAMCHON INTERNATIONAL PATENT AND LAW FIRM (KR)

View/Download PDF      PDF Help

Previous Patent: ASSEMBLABLE COMPLEX TYPE SWIMMING POOL AND METHOD FOR MANUFACTURING SAME

Next Patent: DISPLAY DEVICE