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Title:
BIDIRECTIONAL CONDUCTIVE PATTERN MODULE FOR TESTING SEMICONDUCTOR USING HIGH-PRECISION FABRICATION TECHNIQUE, SEMICONDUCTOR TEST SOCKET USING SAME, AND MANUFACTURING METHOD FOR BIDIRECTIONAL CONDUCTIVE PATTERN MODULE FOR TESTING SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2017/126782
Kind Code:
A1
Abstract:
The present invention relates to a bidirectional conductive pattern module for testing a semiconductor, a semiconductor test socket using the same, and a manufacturing method for the bidirectional conductive pattern module for testing a semiconductor. The bidirectional conductive pattern module for testing a semiconductor according to the present invention comprises: a first conductive pattern part in which a plurality of first conductive lines respectively having a first upper part contact part, a first lower part contact part, and a first middle resilience part that electrically connects the first upper part contact part and the first lower part contact part are arranged in a horizontal direction and spaced apart from one another; a second conductive pattern part in which a plurality of second conductive lines respectively having a second upper part contact part, a second lower part contact part, and a second middle resilience part that electrically connects the second upper part contact part and the second lower part contact part are arranged in the horizontal direction and spaced apart from one another, and which is spaced apart from the first conductive pattern part in a thickness direction; and an insulation plate which is arranged between the first conductive pattern part and the second conductive pattern part so as to electrically insulate the first conductive pattern part and the second conductive pattern part, wherein the first middle resilience part and the second middle resilience part have a curved shape in the horizontal direction so as to have resilience in an upper part direction, the first conductive pattern part and the second conductive pattern part are arranged such that the first upper part contact part and the second upper part contact part are alternately arranged in the horizontal direction, and the first middle resilience part and the second middle resilience part are arranged to overlap in the thickness direction so that a gap between the first upper part contact part and the second upper part contact part that are adjacent each other in the horizontal direction is reduced.

Inventors:
LEE, Eun jou (#501, 84 Yeonghwa-ro Jangan-gu,Sunwon-si, Gyeonggi-do, 16311, KR)
JUNG, Ju yeon (#105-2504 Suwan Hanyang Sujain Apt, 75 Sudeung-ro123beon-gilGwangsan-gu, Gwangju, 62307, KR)
Application Number:
KR2016/012130
Publication Date:
July 27, 2017
Filing Date:
October 27, 2016
Export Citation:
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Assignee:
INNO GLOBAL INC. (123 Cheomdangwagi-ro, Buk-gu, Gwangju, 61005, KR)
International Classes:
G01R1/04; G01R3/00; G01R31/28
Domestic Patent References:
WO2004049429A12004-06-10
Foreign References:
KR101566173B12015-11-05
KR101582956B12016-01-06
JP2002031646A2002-01-31
KR101462968B12014-11-20
Attorney, Agent or Firm:
NAMCHON INTERNATIONAL PATENT AND LAW FIRM (7F 707-ho Gwangju Innobiz center 249 Chuam-ro, Buk-gu, Gwangju, 61003, KR)
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