Title:
BIDIRECTIONAL CONDUCTIVE PATTERN MODULE
Document Type and Number:
WIPO Patent Application WO/2018/135674
Kind Code:
A1
Abstract:
The present invention relates to a bidirectional conductive pattern module, wherein the bidirectional conductive pattern module comprises: a main body in which a plurality of base substrates having an insulating layer made of an insulating material and a conductive layer formed on one surface or both surfaces of the insulating layer are formed laminated in a verticval direction; a plurality of main through-holes which are formed passing through the main body in the vertical direction; an inner insulating wall which is made of an insulating material applied to the inner wall surface side of each of the main through-holes; an inner conductive wall which is formed between the inner wall surface and the corresponding inner insulating wall in at least one of the plurality of main through-holes to mutually electrically connect the conductive layers of the plurality of base substrates; an upper support layer made of an elastic insulating material is attached to an upper surface of the main body, and has a plurality of upper through-holes corresponding to the plurality of main through-holes respectively; a lower supporting layer made of an elastic insulating material is attached to a lower surface of the main body, and has a plurality of lower through-holes corresponding to the plurality of main through-holes, respectively; a plurality of bidirectional conductive pins which are accommodated in the plurality of main through-holes respectively and are each supported by the upper supporting layer and the lower supporting layer respectively in a state where the upper surface thereof is exposed through the upper through-hole in the upper direction and the lower surface thereof is exposed through the lower through-hole in the lower direction. Accordingly, a high-speed test is possible while a pogo-pin type semiconductor test socket can be replaced and a bidirectional conductive pattern module can also be applied to an interposer that electrically connects a high-speed CPU and a substrate between the CPU and the substrate.
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Inventors:
MOON HAE JOONG (KR)
LEE EUN JOU (KR)
JUNG JU YEON (KR)
LEE EUN JOU (KR)
JUNG JU YEON (KR)
Application Number:
PCT/KR2017/000594
Publication Date:
July 26, 2018
Filing Date:
January 18, 2017
Export Citation:
Assignee:
INNO GLOBAL INC (KR)
International Classes:
G01R1/04; G01R1/067; G01R1/073; G01R31/28
Domestic Patent References:
| WO2009011201A1 | 2009-01-22 |
Foreign References:
| KR20010021666A | 2001-03-15 | |||
| JP2010197402A | 2010-09-09 | |||
| KR20100068549A | 2010-06-24 | |||
| US20110199109A1 | 2011-08-18 |
Attorney, Agent or Firm:
NAMCHON INTERNATIONAL PATENT AND LAW FIRM (KR)
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