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Title:
BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, SLURRY COMPOSITION FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTROCHEMICAL DEVICE ELECTRODE, AND ELECTROCHEMICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/004332
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a binder composition for an electrochemical device electrode, the binder composition being capable of forming an electrode mixture layer which has excellent peel strength and powder fall-off resistance and which can make an electrochemical device exhibit high rate characteristics. This binder composition for an electrochemical device electrode is characterized by comprising a binding material and an organic solvent, wherein the binding material includes a particulate polymer A and a polymer B, said particulate polymer A has a core-shell structure composed of a core part and a shell part covering at least a portion of the outer surface of the core part, the glass transition temperature of a polymer that constitutes the shell part is -50°C to 20°C, and the viscosity with respect to the shear rate 1s-1 of a liquid mixture, which is obtained by mixing the polymer B with the organic solvent to have a concentration of 8 mass%, is 100–10,000 mPa∙S.

Inventors:
MESUDA MAKI (JP)
ITO YUKIE (JP)
Application Number:
PCT/JP2019/024968
Publication Date:
January 02, 2020
Filing Date:
June 24, 2019
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
H01M4/62; C08F265/00; H01G11/38
Domestic Patent References:
WO2013183717A12013-12-12
WO2012173089A12012-12-20
WO2016035286A12016-03-10
WO2012115096A12012-08-30
Foreign References:
JP2013247050A2013-12-09
JP2013073921A2013-04-22
JP2012204303A2012-10-22
Other References:
See also references of EP 3817109A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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