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Title:
BINDER COMPOSITION FOR ELECTROCHEMICAL ELEMENT, SLURRY COMPOSITION FOR ELECTROCHEMICAL ELEMENT, FUNCTIONAL LAYER FOR ELECTROCHEMICAL ELEMENT, AND ELECTROCHEMICAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/156086
Kind Code:
A1
Abstract:
Provided is a binder composition for an electrochemical element, the composition comprising a polymer A and water, wherein the polymer A contains 10-90 mass% of an amide group-containing monomer unit and 0.1-50 mass% of an epoxy group-containing monomer unit.

Inventors:
MASUDA AI (JP)
Application Number:
PCT/JP2019/004100
Publication Date:
August 15, 2019
Filing Date:
February 05, 2019
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
H01G11/38; H01G11/52; H01M4/02; H01M4/04; H01M4/62; H01M50/443; H01M50/491; H01M4/13; H01M4/139
Domestic Patent References:
WO2015186363A12015-12-10
WO2012115096A12012-08-30
Foreign References:
JP2010521798A2010-06-24
JP2013168323A2013-08-29
JP2000256616A2000-09-19
JP2013145763A2013-07-25
JP2012204303A2012-10-22
Other References:
See also references of EP 3751637A4
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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