Title:
BINDER COMPOSITION FOR FORMING MOLD
Document Type and Number:
WIPO Patent Application WO/2015/194588
Kind Code:
A1
Abstract:
A binder composition for forming a mold, according to the present invention, comprises a water-soluble phenol resin, and an amine compound containing a polyoxyalkylene group and two or more primary amine groups in a molecule. Provided are a binder composition for forming a mold, which can inhibit a drop in mold strength even when using reclaimed sand made from artificial sand as fire-resistant particles and forming a mold by hardening water-soluble phenol resin using an ester-type curing agent, and a manufacturing method for a mold.
Inventors:
IWAMOTO RYOJI (JP)
Application Number:
PCT/JP2015/067456
Publication Date:
December 23, 2015
Filing Date:
June 17, 2015
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B22C1/22; B22C1/00; C08L61/06
Foreign References:
| JPH04118145A | 1992-04-20 | |||
| JPH10216895A | 1998-08-18 | |||
| JP2011148000A | 2011-08-04 | |||
| JP2011067836A | 2011-04-07 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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