Title:
BINDER COMPOSITION FOR FORMING MOLD
Document Type and Number:
WIPO Patent Application WO/2023/149338
Kind Code:
A1
Abstract:
The present invention is a binder composition for forming a mold for carbon dioxide curing, the binder composition containing an alkali phenol resin, an oxyanion compound, and a tertiary amine compound, and the tertiary amine compound being at least one selected from N,N,N',N",N"-pentamethyldiethylenetriamine, 3,3-iminobis(N,N-dimethylpropylamine), 6-dimethylamino-1-hexanol, bis(2-morpholinoethyl)ether, 2,2-dimethylaminoethoxyethanol, 1,4-diazabicyclo[2.2.2]octane, and triisopropanolamine. According to the present invention, it is possible to provide a binder composition for forming a mold that suppresses dents on the mold surface caused by extrusion pins during removal of the mold from a die, a composition for forming a mold, and a method for producing a mold.
Inventors:
NAKAHATA YU (JP)
KANZAWA TOMOFUMI (JP)
YAMATANI MAKITO (JP)
KANZAWA TOMOFUMI (JP)
YAMATANI MAKITO (JP)
Application Number:
PCT/JP2023/002448
Publication Date:
August 10, 2023
Filing Date:
January 26, 2023
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B22C1/22; B22C9/12; C08K5/17; C08L61/10
Foreign References:
| JPH09314279A | 1997-12-09 | |||
| JP2016002550A | 2016-01-12 | |||
| JP2016020002A | 2016-02-04 | |||
| JP2000015389A | 2000-01-18 | |||
| JP2000079444A | 2000-03-21 | |||
| JPS55136170A | 1980-10-23 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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