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Title:
BINDER COMPOSITION FOR MOLDING MOLD
Document Type and Number:
WIPO Patent Application WO/2017/086379
Kind Code:
A1
Abstract:
The present invention is a binder composition for molding a mold, the binder composition containing a water soluble phenolic resin and a polyvinyl alcohol with an average polymerization degree of no more than 400. This invention is capable of providing the binder composition for molding a mold that can suppress the decrease of mold strength, even when a mold is molded using recycled sand as refractory particles and curing a water soluble phenolic resin with an ester-based curing agent.

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Inventors:
IWAMOTO RYOJI (JP)
ARAKAWA KAZUHITO (JP)
Application Number:
PCT/JP2016/084076
Publication Date:
May 26, 2017
Filing Date:
November 17, 2016
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
B22C1/22
Domestic Patent References:
WO1997001604A11997-01-16
Foreign References:
JPH06114491A1994-04-26
JPH04284940A1992-10-09
JPS5699045A1981-08-10
JPS56163057A1981-12-15
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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