BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING

Title:

BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING

Document Type and Number:

WIPO Patent Application WO/2011/115258

Kind Code:

A1

Abstract:

Disclosed is a binder composition for use in mold manufacturing whereby mold strength degradation in high-humidity environments can be prevented, as can the production of irritant gases during casting. Also disclosed is a composition, using the aforementioned binder composition, for use in molds. The disclosed binder composition contains a furan resin and at least one metal compound containing at least one metallic element selected from among groups 2, 4, 7, 10, 11, and 13 of the periodic table. Said metallic element(s) constitute between 0.01% and 0.70% of the weight of the binder composition. The metal compound(s) comprise(s) at least one compound selected from among the following: hydroxides, nitrates, oxides, organic acid salts, alkoxides, and ketone complexes.

Inventors:

YOSHIDA AKIRA (JP)
MATSUO TOSHIKI (JP)

Application Number:

PCT/JP2011/056581

Publication Date:

September 22, 2011

Filing Date:

March 18, 2011

Export Citation:

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Assignee:

KAO CORP (JP)
YOSHIDA AKIRA (JP)
MATSUO TOSHIKI (JP)

International Classes:

B22C1/22; B22C1/10

Foreign References:

JPS6142449A	1986-02-28
JPS61273237A	1986-12-03
JP2000225437A	2000-08-15
JPS6152952A	1986-03-15
JPS53129292A	1978-11-11
JPS4856520A	1973-08-08
JPH0857575A	1996-03-05
JP2010029905A	2010-02-12
GB1303707A	1973-01-17

Other References: