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Title:
BINDER RESIN FOR CONDUCTIVE PASTE, CONDUCTIVE PASTE, AND SOLAR CELL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2011/001908
Kind Code:
A1
Abstract:
Provided is a binder resin for conductive pastes that is capable of giving a conductive paste in which conductive particles have high dispersibility and which is capable of forming wiring lines having a high aspect ratio and comes to have a low residual carbon content through burning. Also provided are a conductive paste produced using the binder resin for conductive pastes and a solar cell element. The binder resin for conductive pastes comprises a polymer that has a main chain comprising segments derived from a (meth)acrylate monomer and has, in the ω-position, a phosphoric acid-based component represented by general formula (1), wherein X represents an oxygen atom or a sulfur atom and R1 and R2 each represents a hydrogen atom, a C1-13 hydrocarbon group, a C1-13 group derived from a hydroxylated compound, or a C1-13 group derived from a compound having an ester bond.

Inventors:
YAMANAKA Isao (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
山中勲 (〒21 大阪府三島郡島本町百山2-1 積水化学工業株式会社内 Osaka, 〒6180021, JP)
MORIGUCHI Shintaro (1259, Izumi, Minakuchicho, Koka-sh, Shiga 85, 〒5288585, JP)
森口慎太郎 (〒85 滋賀県甲賀市水口町泉1259 積水化学工業株式会社内 Shiga, 〒5288585, JP)
YAMAUCHI Kenji (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
山内健司 (〒21 大阪府三島郡島本町百山2-1 積水化学工業株式会社内 Osaka, 〒6180021, JP)
Application Number:
JP2010/060817
Publication Date:
January 06, 2011
Filing Date:
June 25, 2010
Export Citation:
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Assignee:
Sekisui Chemical Co., Ltd. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満2丁目4番4号 Osaka, 〒5308565, JP)
YAMANAKA Isao (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
山中勲 (〒21 大阪府三島郡島本町百山2-1 積水化学工業株式会社内 Osaka, 〒6180021, JP)
MORIGUCHI Shintaro (1259, Izumi, Minakuchicho, Koka-sh, Shiga 85, 〒5288585, JP)
森口慎太郎 (〒85 滋賀県甲賀市水口町泉1259 積水化学工業株式会社内 Shiga, 〒5288585, JP)
YAMAUCHI Kenji (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
International Classes:
C08F20/18; C08F2/38; C08K3/08; C08L33/14; H01B1/20; H01L31/04
Domestic Patent References:
2005-12-29
Foreign References:
JP2006509883A2006-03-23
JPS60233112A1985-11-19
JP2008050594A2008-03-06
JP2008045044A2008-02-28
JP2007235082A2007-09-13
JP4096661B22008-06-04
JP4248551B22009-04-02
Attorney, Agent or Firm:
YASUTOMI & Associates (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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