Title:
BINDING BAND PROCESSING DEVICE AND BINDING BAND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/141493
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a binding band processing device and binding band processing method that can simply and rapidly process bands without requiring the re-seating of the bands even while reducing the size of the device and reducing the consumption of electric power. [Solution] This binding band processing device, which processes binding bands used for coil shaped rolled steel strips, is characterized by being provided with: a frame; a first rotating roll mounted on the frame; a second rotating roll disposed above the first rotating roll and sandwiching the binding band with the first rotating roll; a third rotating roll for guiding the binding band pushed out by the first rotating roll and the second rotating roll; and a drive mechanism for rotating at least one of the first rotating roll, the second rotating roll, and the third rotating roll.
Inventors:
UCHIYAMA SATOSHI (JP)
Application Number:
PCT/JP2016/081413
Publication Date:
August 24, 2017
Filing Date:
October 24, 2016
Export Citation:
Assignee:
KOHAN KOGYO CO LTD (JP)
International Classes:
B21C47/24; B65B69/00
Foreign References:
JP2010001061A | 2010-01-07 | |||
GB2046147A | 1980-11-12 | |||
JPS6192729A | 1986-05-10 | |||
JPS4722926Y1 | 1972-07-24 | |||
US3557591A | 1971-01-26 | |||
JP2007050925A | 2007-03-01 |
Attorney, Agent or Firm:
OHTA PATENT OFFICE (JP)
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