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Patent Searching and Data


Title:
BINDING BAND
Document Type and Number:
WIPO Patent Application WO/2019/176970
Kind Code:
A1
Abstract:
Provided is a binding band with which wires connected to a connector can be bound into a plurality of groups that are spaced apart from each other. The binding band for binding wires is provided with: a band part (1) which has engagement grooves formed on a surface thereof; and locking parts (2) in which a first insertion hole (21), into which the band part (1) can be inserted, and a second insertion hole (22) are vertically arrayed in the same direction, wherein each of the plurality of locking parts (2) is slidably fitted around the band part (1) by the insertion of the band part (1) into the first insertion holes (21), and the second insertion holes (22) are provided with an engagement claw (23) that serves as a locking mechanism that engages with the engagement groove to lock and prevent the inserted band part (1) from being pulled out.

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Inventors:
SHINBA MINORU (JP)
KYOGOKU MASANORI (JP)
SUGIYAMA YUICHI (JP)
Application Number:
PCT/JP2019/010128
Publication Date:
September 19, 2019
Filing Date:
March 13, 2019
Export Citation:
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Assignee:
KYOCERA DOCUMENT SOLUTIONS INC (JP)
International Classes:
B65D63/14; B65D63/10; F16B2/08; F16B7/04; H02G3/30
Foreign References:
JP2013520954A2013-06-06
US20160297584A12016-10-13
US6807715B12004-10-26
JP2003081324A2003-03-19
JPH0448484U1992-04-24
JPS462860A
JPS478333A
JP2003012021A2003-01-15
Attorney, Agent or Firm:
HORI, Shiroyuki et al. (JP)
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