BIOCOMPATIBLE PACKAGING

Title:

BIOCOMPATIBLE PACKAGING

Document Type and Number:

WIPO Patent Application WO/2010/149762

Kind Code:

A3

Abstract:

A method is described for packaging a device, e.g. for bio-medical applications. The method comprising obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.

Inventors:

OP DE BEECK MARIA (BE)
BEYNE ERIC (BE)
SOUSSAN PHILIPPE (FR)

Application Number:

PCT/EP2010/059055

Publication Date:

April 21, 2011

Filing Date:

June 25, 2010

Export Citation:

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Assignee:

IMEC (BE)
OP DE BEECK MARIA (BE)
BEYNE ERIC (BE)
SOUSSAN PHILIPPE (FR)

International Classes:

H01L29/06; H01L21/78; H01L23/13; H01L23/31

Foreign References:

US6379999B1	2002-04-30
US20030216010A1	2003-11-20
US20050067186A1	2005-03-31
US20040142509A1	2004-07-22
US20080315434A1	2008-12-25
EP0818808A2	1998-01-14

Other References: